| Allicdata Part #: | ATS-05C-81-C1-R0-ND |
| Manufacturer Part#: |
ATS-05C-81-C1-R0 |
| Price: | $ 3.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05C-81-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.03156 |
| 30 +: | $ 2.94945 |
| 50 +: | $ 2.78573 |
| 100 +: | $ 2.62181 |
| 250 +: | $ 2.45796 |
| 500 +: | $ 2.37602 |
| 1000 +: | $ 2.13022 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A thermal heat sink is a device designed to disperse, store, and dissipate heat away from a device or component. The purpose of a thermal heat sink is to keep the temperature of a working component as low as possible. This will be done by dramatically increasing the ability of a material to absorb and dissipate away thermal energy.
The ATS-05C-81-C1-R0 is a thermal heat sink device that features a simple design that makes it great for a variety of applications. It is small, lightweight, and easy to install. The device works by mounting onto a device and utilizing the conductive aluminum fins to disperse heat away from the device.
The ATS-05C-81-C1-R0 is designed to be used in electronics that produce a small amount of heat, such as laptops, tablets, phones, and other portable electronics. The device can handle temperatures up to 55°C, meaning it is suitable for use in devices that produce a low amount of heat. Additionally, the device is designed to be easy to install, making it great for a variety of applications.
The ATS-05C-81-C1-R0 features an aluminum fin design that allows the device to efficiently dissipate heat away from the device. The fin design gives additional surface area to dissipate the heat away, thus keeping the device cooler. The fin design also allows for more efficient and effective heat transfer, which in turn helps to keep the device cooler.
In order to properly utilize the ATS-05C-81-C1-R0, one must ensure that the device is correctly installed. Properly attaching the device to a device or component will ensure that heat is dissipated away from the device and goes through the device\'s fins. This is done by making sure the device is correctly aligned and attached to the working component.
The ATS-05C-81-C1-R0 thermal heat sink is great for a number of applications. Its simple design and efficient performance make it well suited for cooling small devices that produce only a small amount of heat. The device is easy to install and offers great performance, making it a great choice for any number of electronic products that need to be kept cool.
The specific data is subject to PDF, and the above content is for reference