| Allicdata Part #: | ATS-05D-01-C3-R0-ND |
| Manufacturer Part#: |
ATS-05D-01-C3-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05D-01-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 22.05°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sink is an essential component for electronic components. As one of its varieties, the ATS-05D-01-C3-R0 is a kind of thermal heat sink, which is widely used in the industry. This article is about its application field and working principle.
ATS-05D-01-C3-R0 heat sinks are suitable for the use with electronic equipment, such as power module and semiconductor components on the server board. The maximum operating temperature of its product is 175 ℃, which has the capability to maintain long-term stability, protection, cooling, and reduce the temperature of electronic components.
ATS-05D-01-C3-R0 heat sinks also feature an advanced heat transfer technology: wafer-like contact peripheral. This kind of heat transfer technology has minimized thermal impedance between the chip and the heat sink. Moreover, it creates an even distribution to the entire heat dissipation area, bringing out a much better thermal performance. The design has heat dissipation fins that will help to dissipate the heat quickly in the air flow.
Due to its excellent performance, ATS-05D-01-C3-R0 heat sinks can provide a wide range of cooling solutions for the applications that need high speed and high temperature. It can provide superior cooling performance even in the tightest conditions, such as high-speed processors, and sophisticated electronic devices. It has high quality cooling fins which are made from aluminum alloy with good thermal conductivity, ensuring the stability and reliability of the product. Furthermore, the heat transfer material between the chip and the heat sink is filled with a thermal conductive past, resulting in a more efficient heat transfer, allowing the entire system to stay cool under higher temperature and higher processor loads.
In addition, the ATS-05D-01-C3-R0 heat sink provides greater convenience, meaning that users could easily install and remove from the components. As the temperature increases, the heat sink is able to distribute the total load evenly, reducing the strain that could cause the system to overheat or crash. Furthermore, the fins of the heat sink are coated with anti-rust and oxidation-resistant materials, which can prolong its service life.
With all these mentioned, ATS-05D-01-C3-R0 heat sinks are suitable for many kinds of applications. Not only can they lubricate, cool and protect electronic components such as power module and semiconductor components on the server board, but they can also provide stability, reliability and efficiency. With its advanced heat transfer technology and excellent performance, the ATS-05D-01-C3-R0 is definitely one of the most preferred thermal heat sink in the market.
The specific data is subject to PDF, and the above content is for reference