| Allicdata Part #: | ATS-05D-05-C1-R0-ND |
| Manufacturer Part#: |
ATS-05D-05-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05D-05-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.69°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is essential in many applications, and one of the best ways to achieve it is by using a heat sink. Heat sinks are typically used to dissipate heat generated by electronics and other components, and the ATS-05D-05-C1-R0 is a great example. It is an efficient and reliable passive cooling solution that is easy to install, and suitable for a variety of applications.
The ATS-05D-05-C1-R0 heat sink is constructed of an aluminum housing and fin array, resulting in lightweight but strong structure. Its optimized fin geometry allows it to dissipate heat quickly and effectively and its total area of over 130 square inches provides more than enough surface area to cool medium-sized components. The fin array is treated with a black anodized coating that provides superior corrosion protection, making it suitable for a wide range of applications. It also features an integrated mounting clip that allows for quick and hassle-free installation.
The ATS-05D-05-C1-R0\'s heat dissipation ability is based on the natural convection of air. As heat from the components rises, it is drawn away from the component and transferred to the fins of the heat sink. As the fins warm up, the air around them is warmed, creating an updraft of air. This causes the air to move up and away from the heat sink, taking the heat with it. This process of cooling is continuous until the component has cooled to a desired temperature or achieves thermal equilibrium.
The ATS-05D-05-C1-R0\'s thermal design allows it to be used in a wide variety of applications, including applications where higher temperatures are present, such as overclocked semiconductors, CPUs, and GPUs. It can also be used in consumer electronics such as televisions, video game consoles, mobile phones, and computers. It is a great choice for small form factor applications as well, due to its slim profile and low weight.
The ATS-05D-05-C1-R0 heat sink is an efficient and reliable solution for thermal management. Its aluminum construction ensures that it is lightweight yet strong, and its fin geometry and anodized coating offer superior cooling performance and corrosion protection. Its quick installation and wide variety of applications makes it an ideal choice for anyone looking for a high-performance passive heating solution.
The specific data is subject to PDF, and the above content is for reference