| Allicdata Part #: | ATS-05D-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-05D-10-C1-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05D-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28104 |
| 30 +: | $ 3.19242 |
| 50 +: | $ 3.01505 |
| 100 +: | $ 2.83771 |
| 250 +: | $ 2.66036 |
| 500 +: | $ 2.57169 |
| 1000 +: | $ 2.30565 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are highly efficient and widely used in many thermal applications, such as electronics, aerospace, automotive, medical, LED, optoelectronics, power supplies, motors, and many more. The heat sink material of choice is usually aluminum or copper, though some thermoelectrics utilize special composite materials.
The ATS-05D-10-C1-R0 heat sink application is one of the most popular and versatile thermal solutions available today. It is designed to provide a high level of cooling performance in a variety of applications. The primary purpose of a heat sink is to absorb and dissipate heat generated by electronic components. This is accomplished by transferring the heat away from the component and into the environment.
The ATS-05D-10-C1-R0 heat sink uses two thermally conductive materials, aluminum and copper. The aluminum is used for the base plate and the copper heat pipes, while the copper offers superior thermal conductivity for active cooling applications. The heat pipes draw heat away from the components and dissipate the heat through extended fins.
The ATS-05D-10-C1-R0 heat sink utilizes an advanced technology called vapor chamber technology. This technology is designed to optimize heat transfer from the components to the fins. The vapor chamber design helps to rapidly and evenly distribute heat throughout the entire physical structure of the heat sink. This reduces the temperature gradient, allowing for more efficient operation. The use of copper for the heat pipes also helps to reduce the thermal resistance, allowing for better temperature control.
In addition, the ATS-05D-10-C1-R0 heat sink application is also designed for noise reduction. The design minimizes the fan size to help reduce the noise that is associated with some traditional cooling solutions. The reduced fan size also helps to reduce the overall power consumption of the system. Additionally, the integrated fan guard reduces potential air turbulence, helping to reduce noise.
The ATS-05D-10-C1-R0 heat sink application is designed for a variety of applications, including servers, workstations, gaming systems, and embedded systems. This highly efficient heat sink is perfect for any application where high performance cooling is required. The compact design allows for easy installation in a variety of chassis types. The use of copper for the heat pipes helps to reduce power consumption while also improving thermal performance. With the integrated fan guard design, noise is also minimized, making the ATS-05D-10-C1-R0 a perfect solution for a variety of applications.
The specific data is subject to PDF, and the above content is for reference