| Allicdata Part #: | ATS-05D-116-C3-R0-ND |
| Manufacturer Part#: |
ATS-05D-116-C3-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05D-116-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are devices designed to dissipate large amounts of heat generated by electronic components and other systems. Heat sinks provide cooling solutions in a variety of applications ranging from computers and laptops to industrial manufacturing and automotive applications. The ATS-05D-116-C3-R0 Heat Sink is designed for use in a variety of applications.
ATS-05D-116-C3-R0 Application Field
The ATS-05D-116-C3-R0 Heat Sink is a compact, low-cost, high-efficiency solution for a wide range of applications. Ideal for low power electronics and other delicate components, this heat sink can be used to dissipate heat in various settings including telecommunication, consumer electronics, automotive, and industrial markets. In addition, the ATS-05D-116-C3-R0 is designed to provide maximum thermal control, making it suitable for systems with limited space and thermal requirements.
ATS-05D-116-C3-R0 Working Principle
The ATS-05D-116-C3-R0 Heat Sink is designed to provide maximum thermal control according to the principles of thermodynamics, which deals with the flow of heat. When an electronic component is switched on, the energy released is converted to heat. This heat is then dissipated by the heat sink material, which in turn is cooled down by the surrounding air or liquid coolant. Heat sinks are used to cool down the hot components by conduction and convection, transferring the heat from the component to the air or liquid coolant.
The ATS-05D-116-C3-R0 Heat Sink relies on the principles of convection and conduction to dissipate heat. Convection occurs when air or liquid coolant is moved by fans, pumps or water-towers, carrying heat away from the component. Conduction is the transfer of thermal energy from a warmer component to a cooler one. Heat sinks rely on aluminum, copper and metal material structures to aid in heat dissipation.
The ATS-05D-116-C3-R0 Heat Sink is designed to provide maximum thermal control by using a combination of convection and conduction. In addition, the heat sink is designed with a unique fin structure that creates a high-efficiency surface for heat transfer to the air or liquid coolant. By using a combination of convection and conduction coupled with an efficient fin structure, the ATS-05D-116-C3-R0 heat sink offers superior thermal management and cooling performance.
Conclusion
The ATS-05D-116-C3-R0 Heat Sink is designed for use in a variety of applications. It is specifically designed for maximum thermal control and superior heat transfer. The device utilizes a combination of convection and conduction along with a unique fin structure to provide efficient thermal management and cooling performance. This makes it suitable for systems with limited space and thermal requirements, making it an ideal solution for all types of settings.
The specific data is subject to PDF, and the above content is for reference