ATS-05D-124-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-05D-124-C3-R0-ND

Manufacturer Part#:

ATS-05D-124-C3-R0

Price: $ 3.94
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-05D-124-C3-R0 datasheetATS-05D-124-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.58596
30 +: $ 3.38646
50 +: $ 3.18730
100 +: $ 2.98809
250 +: $ 2.78888
500 +: $ 2.58968
1000 +: $ 2.53987
Stock 1000Can Ship Immediately
$ 3.94
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.25°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks, the most basic of thermally managed structures, are used to regulate and control temperatures within an environment. In electronics, heat sinks are used to ensure that devices run within an optimal temperature range, protecting electronic components from damage. As such, having a reliable and efficient heat sink is critical to maintaining the longevity of electronics, particularly through increasing airflow and decreasing the surface temperature of devices.

The ATS-05D-124-C3-R0 Heat Sink is a thermally managed heat sink designed to dissipate heat from electronic components. It features a 6-fin, all-aluminum construction with an integrated copper base for increased thermal conductivity and heat absorption. The fins are arranged in an axial direction, providing maximum surface area for processing heat expelled from the device. The robust construction and heat dissipation capabilities of the ATS-05D-124-C3-R0 make it the ideal heat sink for use in a wide variety of applications.

The ATS-05D-124-C3-R0 is designed for use in applications that require high performance thermal management. These include devices such as LED displays, servers, PCs, processors, high-tech equipment, and portable electronics. The ATS-05D-124-C3-R0 is also suitable for use in industrial equipment, air conditioner compressors, and disc brakes. Its robust construction also makes it a perfect choice for automotive applications.

The ATS-05D-124-C3-R0 has a working principle based on the law of thermodynamics. In this, heat flows from an area of high temperature to an area of lower temperature. Heat is absorbed by the copper base and then dissipated by the array of fins, giving it an excellent heat dissipation capacity. Additionally, the fins also act as a buffer, allowing air to circulate and disperse heat away from the device. As such, the ATS-05D-124-C3-R0 is an ideal choice for devices that require a high-performance cooling solution.

The ATS-05D-124-C3-R0 features an impressive performance. It is capable of dissipating up to 135 watts of thermal load, offering superior heat dissipation for even the highest performing devices. The copper base further enhances its thermal performance, allowing it to quickly and efficiently absorbheat. The entire heat sink is also compact and lightweight, making it suitable for use in space-limited settings.

Overall, the ATS-05D-124-C3-R0 Heat Sink is an ideal choice for thermal management applications that require improved performance and reliability. Featuring a 6-fin design and a copper base, it is the perfect solution for cooling and preventing device damage from overheating. This makes it a must-have component for mission-critical applications, such as servers, LED displays, and other industrial equipment. With its solid construction, impressive thermal performance, and lightweight packaging, the ATS-05D-124-C3-R0 is an excellent choice for thermal management applications.

The specific data is subject to PDF, and the above content is for reference

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