| Allicdata Part #: | ATS-05D-137-C3-R0-ND |
| Manufacturer Part#: |
ATS-05D-137-C3-R0 |
| Price: | $ 3.20 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05D-137-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.91249 |
| 30 +: | $ 2.83395 |
| 50 +: | $ 2.67649 |
| 100 +: | $ 2.51899 |
| 250 +: | $ 2.36157 |
| 500 +: | $ 2.28284 |
| 1000 +: | $ 2.04668 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.63°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important consideration in various industries, as heat affects electronic components, often leading to their damage or poor performance. Heat sinks are widely used in commercial and industrial applications to dissipate heat from electronic components. The ATS-05D-137-C3-R0 heat sink is specially designed for use in high-density electronic equipment. This article will cover the application fields and working principles of ATS-05D-137-C3-R0 heat sink.
The ATS-05D-137-C3-R0 heat sink is a device designed to conduct heat generated by electronic equipment away from sensitive components. It is made of thermal grade aluminum and consists of an array of fins that are attached to a flat base. The flat base is then mounted on the circuit board and the fins of the heat sink are exposed to the surrounding air, allowing the heat to be dissipated. The ATS-05D-137-C3-R0 has a small footprint and is best suited for use in high-powered devices such as CPUs, GPUs, and power ASICs.
The ATS-05D-137-C3-R0 heat sink is designed to effectively dissipate heat in applications where the amount of heat generated is higher than normal. For example, when high-powered components such as CPUs and GPUs are used in a system, the electronics will generate more heat than usual, and the ATS-05D-137-C3-R0 heat sink is designed to effectively dissipate that heat. This enables the components to operate within their maximum safe temperature range, which improves performance and reduces the risk of system damage due to overheating.
The ATS-05D-137-C3-R0 heat sink works on the principle of conduction. Heat is conducted away from the source through the base and fins of the heat sink, and is then dissipated into the surrounding air. To ensure that the heat sink works as efficiently as possible, it must be properly sized for the application. Under-sizing the heat sink will lead to insufficient heat dissipation, leading to overheating, while over-sizing can cause the device to take up too much space in the system.
The ATS-05D-137-C3-R0 heat sink is suitable for applications where space is limited, such as when the electronics are enclosed in a sealed case. The small size and low profile of the ATS-05D-137-C3-R0 make it an ideal choice for cooling high-power components in small form factor systems. As the heat sink is made of aluminum, it is lightweight and can be quickly and easily installed in the system.
In summary, the ATS-05D-137-C3-R0 heat sink is a highly efficient device designed for use in high-density electronic equipment. It is made of thermal grade aluminum and relies on conduction to dissipate heat from the source. The ATS-05D-137-C3-R0 is suitable for applications where the amount of heat generated is higher than normal, and where space is limited. It is lightweight and has a low profile, making it ideal for cooling high-powered components in small form factor systems.
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