| Allicdata Part #: | ATS-05D-139-C1-R0-ND |
| Manufacturer Part#: |
ATS-05D-139-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05D-139-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.82933 |
| 30 +: | $ 2.75289 |
| 50 +: | $ 2.60001 |
| 100 +: | $ 2.44705 |
| 250 +: | $ 2.29408 |
| 500 +: | $ 2.21761 |
| 1000 +: | $ 1.98820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A thermal heat sink is a device that is used to dissipate heat from a hot component or object into the surrounding environment. The device is typically made up of a metal housing, or thermal dissipating base, and a fan, or fan base, to push the air around the device to increase heat dissipation. The ATS-05D-139-C1-R0 is a thermal heat sink designed to dissipate high-powered electronic components such as CPUs, GPUs, and memory modules in data centers and other applications.
The ATS-05D-139-C1-R0 has a maximum dissipation capacity of 176 W. It is made up of a base plate with a thermally conductive copper structure made of 0.5mm thick heat pipes beneath the plate. The copper structure is combined with a heatsink consisting of several aluminum fins that direct the airflow from the fan base so that it can cool the hot components. The device also includes a 5-blade fan with 10mm of profile height. The fan is designed with an optimized arrangement of blades to provide optimal cooling and low noise operation.
The heat sink has a direct thermal pad connection for mounting the thermal interface material (TIM).The TIM must be able to dissipate enough heat for the device to perform optimally. A fan speed controller is also included to ensure the optimal fan speed is achieved. The device has an operating temperature range of 0-70 °C, making it suitable for use in various environments.
The ATS-05D-139-C1-R0 thermal heat sink is designed with an effective heat dissipation solution. It is designed to meet the needs of data centers and other high-powered applications. The device is easy to mount and can be used in a wide range of environments. It can also provide low noise operation, making it ideal for those who want a quiet environment.
The ATS-05D-139-C1-R0 thermal heat sink is an efficient solution for dissipating high-powered components. Its copper base and aluminum fin design provides optimal heat dissipation while the fan base and speed controller ensure the optimal speed is achieved. The device is easy to mount and can be used in a variety of environments. With its robust design and low noise operation, the ATS-05D-139-C1-R0 can be used in data centers and other applications for optimal thermal management.
The specific data is subject to PDF, and the above content is for reference