ATS-05D-161-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-05D-161-C3-R0-ND

Manufacturer Part#:

ATS-05D-161-C3-R0

Price: $ 4.41
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X20MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-05D-161-C3-R0 datasheetATS-05D-161-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.96711
30 +: $ 3.74703
50 +: $ 3.52661
100 +: $ 3.30618
250 +: $ 3.08577
500 +: $ 2.86535
1000 +: $ 2.81025
Stock 1000Can Ship Immediately
$ 4.41
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.82°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The development of electronic components has led to increasingly smaller and more powerful products. To ensure that these devices operate efficiently and safely, they require reliable heat management solutions. Thermal – Heat Sinks are an effective way of ensuring that electronic components remain within optimal temperature ranges during operation, reducing the risk of overheating or damage. The ATS-05D-161-C3-R0 is a Heat Sink designed for use with a wide range of electronic components, such as Voltage Regulators, LED Lights, FET Drivers and MOSFETs.

The ATS-05D-161-C3-R0 is made from a combination of thermally conductive materials including copper, aluminum and silicon. These materials are engineered to ensure optimum thermal performance by transferring heat away from sensitive components and dissipating it into the surrounding air. This allows for more efficient operation of the component and extends its lifespan. The Heat Sink’s design also incorporates fins that increase the surface area exposed to the air, increasing the rate at which heat is dissipated from the component.

The ATS-05D-161-C3-R0 is designed to be used in conjunction with a fan. The fan provides additional airflow which increases the effectiveness of the Heat Sink by providing the component with extra cooling capacity. This combination of fan and Heat Sink ensures that the component remains within optimal operating temperatures.

The ATS-05D-161-C3-R0 is suitable for a wide range of electronic applications and can be used to manage the temperature of a variety of devices, including power supplies, DC-DC converters, amplifiers and radio frequency systems. To ensure maximum performance, it is important to select a Heat Sink that is appropriate for the application. It is also important to select an appropriate fan, as the fan’s airflow is essential for the Heat Sink\'s effectiveness.

The ATS-05D-161-C3-R0 is an effective way of managing heat on a variety of electronic components, ensuring they remain within safe operating temperatures and extend their lifespan. By selecting a suitable Heat Sink and fan, the user can be confident that the component will remain safe and operate efficiently.

The specific data is subject to PDF, and the above content is for reference

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