ATS-05D-176-C1-R0

Thermal - Heat Sinks

The ATS-05D-176-C1-R0 is a popular thermal solution, most often used when sensitive electronic components need to be cooled off and operated safely. The product features a heat sink made of extruded aluminium, a thermally efficient base plate, an elaborate fin structure for air flow, and a flexible mounting frame. While this thermal solution is just one type of many, it is one of the most widely used in the industry, due to its ability to provide reliable and efficient cooling.

Application Field

The ATS-05D-176-C1-R0 is used to cool off components with an integrated circuit or processor. This includes items like routers, laptops, and multi-core processors. It can also be used to cool off semiconductor chips in consumer electronics, computers, and other electronic devices. This helps protect the components from overheating and enables them to keep functioning safely.

Working Principle

The ATS-05D-176-C1-R0 utilizes a combination of passive and active cooling methods to disperse heat from the components. Heat is dissipated from the components through conduction, which occurs when heat is transferred from one material to another material that has a different temperature. Heat is then drawn up through a process called natural convection. This means that the heat rises through the device and is expelled into the air. The fins on the thermal solution then increase the surface area for air flow, which helps to increase the rate at which heat is dissipated from the device. Finally, active cooling fans can be used to further reduce the temperature.

Conclusion

The ATS-05D-176-C1-R0 is a cost effective and reliable thermal solution. It prevents electronic components from overheating and helps maintain a stable temperature. This ensures that the components can keep functioning safely and remain operational for a long time, without any risk to the device or its user. This makes the ATS-05D-176-C1-R0 a popular choice among electronics manufacturers and designers.