ATS-05D-198-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.472" (12.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	9.21°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-05D-198-C3-R0 thermal heat sink is a component designed to act as a cooling apparatus for high-powered electrical systems. The product has a wide range of applications in various sectors, from consumer electronics to industrial machinery. The heat sink works by transferring the heat generated by components like transistors, integrated circuits, and microprocessors, away from the system. In order to effectively dissipate the heat generated, the heat sink is usually equipped with a fan and ventilation systems.

Design and Construction

The ATS-05D-198-C3-R0 thermal heat sink is constructed from aluminum extrusion with a black difficult-anodized finish. The design of the heat sink has a finned square panel shape with a 10 mm high vertical fin for increased surface area. The heat sink is fitted with four mounting holes for mounting to an electronic system with 8-32 thread size screws.The fan included with the heat sink has a 12v direct current (DC) motor with a maximum air flow of 40 CFM. The fan has a 4-wire connection, allowing for system monitoring via the Pulse Width Modulation (PWM) control, and is also compatible with temperature sensors. Additionally, the fan is constructed with a copper sleeve and is IP68 dust and waterproof rated.

Application Field and Working Principle

The ATS-05D-198-C3-R0 thermal heat sink is used in a range of applications, including industrial machinery, communication equipment, computers, and consumer electronics. The product is also suitable for harsh ambient environments, as the design and construction provide protection against corrosion, dust, and water.The primary function of the heat sink is to dissipate the heat generated by electrical components such components like transistors, integrated circuits, and microprocessors away from the system. The fan included in the heat sink is designed to draw the hot air away from the component, while the heat sink itself dissipates the heat into the surrounding air. The additional fins on the heat sink provide an increased surface area, which further facilitates the transfer of heat out of the system.

Conclusion

The ATS-05D-198-C3-R0 thermal heat sink is designed to be a reliable, efficient, and cost-effective cooling device for high-powered electronics. The product is built from anodized aluminum extrusion and equipped with a fan and ventilation systems, ensuring that heat is dissipated efficiently and effectively from the system. Additionally, the design of the heat sink allows it to be used in a range of industries and applications, providing a versatile and reliable cooling option for any system.

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