| Allicdata Part #: | ATS9694-ND |
| Manufacturer Part#: |
ATS-05D-203-C2-R0 |
| Price: | $ 4.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-05D-203-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.83040 |
| 10 +: | $ 3.72456 |
| 25 +: | $ 3.51767 |
| 50 +: | $ 3.31065 |
| 100 +: | $ 3.10376 |
| 250 +: | $ 2.89684 |
| 500 +: | $ 2.68992 |
| 1000 +: | $ 2.63820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are a type of heat dissipation device that is made of a plate or base and multiple fins. They are primarily used in electronic equipment to disperse heat from the hot components within the equipment. This is done by passing the electronic components through a heat sink to aid in heat transfer and dissipation. The ATS-05D-203-C2-R0 is a type of thermal heat sink. It is typically used in applications that require a long lifetime, low cost, high output, and compact size.
The ATS-05D-203-C2-R0 functions as a heat sink by utilizing thermal conductivity and heat-dissipation principles. The sink contains its own thermal plate, made of aluminum, to disperse the heat away from the active components. This plate is surrounded by dozens of aluminum fins which creates a large surface area for the heat to dissipate into the surrounding environment. The construction of the ATS-05D-203-C2-R0 also aids in heat transfer as the fins have multiple layers for the heat to travel through.
The ATS-05D-203-C2-R0 thermal heat sink can be applied to a wide range of devices, such as diodes, transistors, circuits, and other heat-generating electronic components. It can be used as a standalone cooling solution, as it is self-contained, but is often combined with other cooling methods, such as fans or other heat sinks. The ATS-05D-203-C2-R0 is often used in applications that require low cost, high output, and long lifetime. For example, it can be found in LED lighting applications, solar panels, automotive applications, and more.
In summary, the ATS-05D-203-C2-R0 is a thermal heat sink that is primarily used in devices to dissipate the heat generated by the components. It is a low cost, compact, and high-output solution that can be applied to numerous electronic components and products. The ATS-05D-203-C2-R0 is manufactured with an aluminum plate and fins for improved heat transfer and dissipation. With its long lifetime and versatile applications, the ATS-05D-203-C2-R0 is an optimal thermal heat sink for most electronic devices.
The specific data is subject to PDF, and the above content is for reference
ATS-05D-203-C2-R0 Datasheet/PDF