ATS-05D-36-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	1.450" (36.83mm)
Width:	2.267" (57.60mm)
Diameter:	--
Height Off Base (Height of Fin):	0.450" (11.43mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	14.81°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are essential components of electronic devices due to their ability to dissipate heat and maintain peak performance of the device. The ATS-05D-36-C1-R0 is a new generation of heat sink designed for high-performance applications. The unique design features of the ATS-05D-36-C1-R0 make it one of the most reliable and effective heat sinks on the market today.

Application field

The ATS-05D-36-C1-R0 is a thermal management solution designed for high-performance computing and consumer electronics applications where thermal performance is a priority. The ATS-05D-36-C1-R0 is specifically designed for use with Intel and AMD CPUs, GPUs, and other high-performance components that generate a lot of heat. The ATS-05D-36-C1-R0 is optimized for low power consumption and low noise production, making it ideal for small form factor applications.

Design

The ATS-05D-36-C1-R0 is a two-piece thermal solution consisting of a base heat sink and fan assembly. The base heat sink is constructed from extruded aluminum and designed with a serpentine fin pattern to maximize surface area for improved heat transfer. The fins are precision-machined to reduce air resistance and improve static pressure, resulting in better cooling performance. The ATS-05D-36-C1-R0 also features a copper vapor chamber for superior heat transfer. The copper vapor chamber dissipates heat quicker than standard aluminum fins, enabling the ATS-05D-36-C1-R0 to operate at higher power levels with better efficiency.

Fan Assembly

The fan assembly of the ATS-05D-36-C1-R0 consists of a high-efficiency blower motor, four rubber anti-vibration mounts, and a four-pin connector. The blower motor quickly circulates air across the heat sink fins while the anti-vibration mounts help reduce noise and improve stability. The included four-pin connector allows the fan to be connected directly to the motherboard and controlled via the system’s fan controller. The ATS-05D-36-C1-R0 is also compatible with PWM fan controllers, providing users with more control over fan speed and noise.

Working Principle

The ATS-05D-36-C1-R0 operates using the principles of convective and conductive heat transfer. The extruded aluminum fins of the heat sink act as a large heat spreader, distributing the heat generated by the CPU or GPU across a greater surface area. The fins act as a barrier between the hot CPU and the ambient air, allowing the air to absorb the heat from the fins. The fan then circulates the air away from the heat sink to dissipate the heat into the surrounding atmosphere. The copper vapor chamber further enhances the heat transfer by quickly conducting the heat away from the CPU or GPU to the fins of the heat sink. This improves both the thermal performance and efficiency of the ATS-05D-36-C1-R0.

Conclusion

The ATS-05D-36-C1-R0 is a high-performance thermal management solution designed for high-performance computing and consumer electronic applications. The two-piece fan and heat sink assembly utilizes a combination of convective and conductive heat transfer for superior thermal performance and efficiency. The unique design features of the ATS-05D-36-C1-R0 make it one of the most reliable and effective thermal solutions on the market today.

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