| Allicdata Part #: | ATS-05D-40-C2-R0-ND |
| Manufacturer Part#: |
ATS-05D-40-C2-R0 |
| Price: | $ 6.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X11.43MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05D-40-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.86467 |
| 30 +: | $ 5.53854 |
| 50 +: | $ 5.21275 |
| 100 +: | $ 4.88697 |
| 250 +: | $ 4.56117 |
| 500 +: | $ 4.23538 |
| 1000 +: | $ 4.15393 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.56°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat transfer is an important subject in engineering as it helps to maintain components and machines at optimal temperatures. Heat sinks are important components used in a wide variety of machines and applications that can effectively dissipate heat from components and ensure their optimal operation. The ATS-05D-40-C2-R0 heat sink is a high-performance, compact heat sink designed for cooling high power electronics. This thermal-heaat sink has a multitude of applications and a working principle that enables it to dissipate heat efficiently from components.
This heat sink’s main application is in the cooling of power semiconductors such as rectifiers or switching power supplies. The ATS-05D-40-C2-R0 heat sink is designed to dissipate heat generated by these components effectively. Its special design is optimized to provide superior cooling for these kinds of components. It is constructed from an aluminum alloy that has high thermal conductivity and can dissipate heat quickly and efficiently. It also has a low thermal resistance and is therefore capable of dissipating heat at a lower temperature than conventional methods. Additionally, the ATS-05D-40-C2-R0 heat sink is designed to fit easily into tight spaces, making it ideal for small form factor designs.
The ATS-05D-40-C2-R0 heat sink works according to a “convection principle” that takes advantage of the natural movement of air to dissipate heat from components. The heat sink is designed to facilitate the flow of air and the transfer of heat from the components to the outside environment. The aluminum alloy from which it is constructed helps to conduct heat away from the components and the special design of the fins helps to maximize the surface area for maximum heat dissipation. Additionally, the heat sink is designed to provide a low thermal resistance, which allows for more efficient heat transfer. The resulting reduced temperatures help to protect the components from prolonged exposure to high temperatures and potential damage.
The ATS-05D-40-C2-R0 heat sink is an ideal choice for cooling high power electronics, as it can provide superior cooling for all kinds of components. Its small size makes it ideal for use in small spaces, and its efficient design makes it capable of dissipating heat in an effective manner. In addition, its unique design that takes advantage of convection allows for the efficient transfer of heat and ensures that components are well-protected from excessive temperatures. The ATS-05D-40-C2-R0 heat sink is an excellent thermal-heat sink for cooling power semiconductors and many other kinds of components.
The specific data is subject to PDF, and the above content is for reference