ATS-05D-48-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS9717-ND

Manufacturer Part#:

ATS-05D-48-C2-R0

Price: $ 3.95
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X35MM L-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-05D-48-C2-R0 datasheetATS-05D-48-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.59100
10 +: $ 3.49335
25 +: $ 3.29918
50 +: $ 3.10502
100 +: $ 2.91098
250 +: $ 2.71691
500 +: $ 2.52285
1000 +: $ 2.47433
Stock 1000Can Ship Immediately
$ 3.95
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.51°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat management is a critical issue in many industries, ranging from computers and electronics to motors and pumps. The ATS-05D-48-C2-R0 is a thermal management device intended to help regulate temperatures in these applications. This product is part of a larger category known as thermal heat sinks, which are designed to absorb and dissipate heat from enclosed components or assemblies.

A heat sink is a device used to transfer thermal energy away from its source, using natural or forced airflow. The ATS-05D-48-C2-R0 features a designed groove that works to reduce the contact area between the heat sink and the device it is attached to, increasing the efficiency of heat transfer. The groove is also designed to maximize the turbulence of the cooling air, improving heat dissipation further.

This heat sink also features an optimized profile that increases surface area for more efficient heat absorption. The extruded aluminum fin array allows air to naturally flow over the fin array, transferring the heat away from the source and towards the surrounding environment.

The ATS-05D-48-C2-R0 comes with a pattern treatment on the surface of the heat sink, enabling it to have higher conductivity and better performance. This treatment also increases the surface area of the heat sink, helping with efficient removal of heat from the source. It also offers better corrosion resistance, which helps protect the device from wear and tear.

In addition to its optimized design, the ATS-05D-48-C2-R0 has a compact form factor. This makes it an ideal choice for applications where space is a priority. The product is also highly cost-effective and can be integrated easily into existing systems, making it a great choice for those seeking a reliable thermal solution.

The ATS-05D-48-C2-R0 is designed to be used in a variety of applications. It can be used to dissipate heat from the components of computers and other electronic equipment, such as memory cards, power supplies, and motherboards. It can also be used in motors, pumps, and other machinery to reduce heat build-up and improve longevity. Furthermore, the product is suitable for use in medical equipment, where temperatures must be precisely regulated to ensure safety and efficacy.

Overall, the ATS-05D-48-C2-R0 is a convenient and efficient thermal heat sink solution that can be used in a wide variety of applications. Its optimized design and compact form factor make it an excellent choice for those looking to effectively dissipate heat from their components, motors, pumps, and other applications.

The specific data is subject to PDF, and the above content is for reference

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