| Allicdata Part #: | ATS-05D-50-C1-R0-ND |
| Manufacturer Part#: |
ATS-05D-50-C1-R0 |
| Price: | $ 3.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05D-50-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.94840 |
| 30 +: | $ 2.86860 |
| 50 +: | $ 2.70925 |
| 100 +: | $ 2.54986 |
| 250 +: | $ 2.39047 |
| 500 +: | $ 2.31079 |
| 1000 +: | $ 2.07174 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are typically used in calculation, automation, in addition to the many applications in electronic devices, such as telecommunication, computers and automotive systems.
The ATS-05D-50-C1-R0 is one such thermal solution used in the aforementioned applications. This device is often used to dissipate heat from a component or device as quickly as possible in order to ensure that there is no damage or disruption to the device in use.
The ATS-05D-50-C1-R0 is a low profile heat sink that is designed for use in a variety of different applications. It is made up of aluminum alloy and is particularly well suited for cooling complex electronics such as circuit boards, LEDs and Processor ICs and components. It also features a low-profile design which allows it to fit within tight spaces and is highly effective in dissipating heat away from the component being cooled.
The working principle of the ATS-05D-50-C1-R0 is as follows: The device uses heat conduction to transfer heat away from the component being cooled and disperse it into its surroundings. This is achieved by means of the aluminum alloy acting as a conductor, transferring the heat away from the component and then dissipating it into the air or other materials. As the heat sink is used, small amounts of heat are also dissipated through the body of the device, helping to further cool the component.
The ATS-05D-50-C1-R0 is highly applicable in many applications, but some of the most common are calculations, automation, telecommunications, computers, and automotive systems. These are all areas where efficient heat management is essential, and the ATS-05D-50-C1-R0 is well suited to these applications. Its aluminum alloy construction also makes it durable and resistant to wear and tear, making it an ideal choice for long-term usage.
In conclusion, the ATS-05D-50-C1-R0 is an efficient and reliable thermal solution for a wide range of applications. It is quick and effective in dissipating heat away from components, and its aluminum alloy construction makes it highly durable and resistant to wear and tear. As such, it is a great choice for efficient temperature control in any electronic device.
The specific data is subject to PDF, and the above content is for reference