Allicdata Part #: | ATS-05D-51-C3-R0-ND |
Manufacturer Part#: |
ATS-05D-51-C3-R0 |
Price: | $ 3.69 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 30X30X20MM L-TAB T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ATS-05D-51-C3-R0 Datasheet/PDF |
Quantity: | 1000 |
10 +: | $ 3.31695 |
30 +: | $ 3.22707 |
50 +: | $ 3.04781 |
100 +: | $ 2.86858 |
250 +: | $ 2.68930 |
500 +: | $ 2.59965 |
1000 +: | $ 2.33071 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.181" (30.00mm) |
Width: | 1.181" (30.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.790" (20.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 14.22°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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Heat sinks are used to dissipate excess heat generated by electrical or other processes, usually protecting sensitive circuits and other components from damage. This is done by collecting and conveying the heat away from these components, and into the surrounding area. The ATS-05D-51-C3-R0 is a thermal - heat sink designed to do this, and is suitable for use in a wide variety of applications.
The ATS-05D-51-C3-R0 thermal - heat sink is designed to provide adequate cooling for a variety of electronic components, including microprocessors, CPUs, ICs, transistors, and other high power components. It is constructed from a high-quality aluminum alloy, and features a unique interlocking structure to maximize the surface area available for heat dissipation. The heat sink also features an anodized gold-tone finish, which not only looks attractive, but also helps to further improve its thermal performance.
In terms of its application field, the ATS-05D-51-C3-R0 thermal - heat sink is suitable for use in audio/video systems, consumer electronics, military/industrial applications, aerospace, telecommunications, medical electronics, and more. It is also suitable for use in computers, servers, and other computer peripherals. The heat sink is also suitable for use in solar cells, photovoltaic systems, LED lighting, and other heat-generating components.
The ATS-05D-51-C3-R0 thermal - heat sink works by drawing heat away from the interior of the system, and dissipating it into the environment. It does this through a combination of conduction and convection. Conduction involves the transfer of heat from the components into the heat sink, which then dissipates the heat into the surrounding environment. Convection, on the other hand, involves the transfer of heat from the hot components to the cooler environment. Both of these processes help to keep the system cool, by dissipating the heat away from the components.
The ATS-05D-51-C3-R0 thermal - heat sink also features an adjustable fan speed control, allowing users to customize its performance to their specific requirements. This feature helps to ensure that the heat sink can handle the demands of its intended environment, while allowing for energy savings and improved reliability. Additionally, the fan can be stopped when the system is not in use, and the fan speed can be adjusted to minimize noise pollution.
In summary, the ATS-05D-51-C3-R0 thermal - heat sink is an ideal solution for cooling high power components, while also providing improved reliability and a lower noise output. It can be used in a variety of applications, including audio/video systems, consumer electronics, military/industrial applications, aerospace, telecommunications, and medical electronics. Furthermore, the adjustable fan speed control allows users to customize its performance, while also providing energy savings and improved reliability.
The specific data is subject to PDF, and the above content is for reference