| Allicdata Part #: | ATS-05D-57-C1-R0-ND |
| Manufacturer Part#: |
ATS-05D-57-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05D-57-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-05D-57-C1-R0 thermal-heat sink is a compact heat sink accessory designed to dissipate heat from high-performance components. It is a small, lightweight device capable of dissipating heat quickly and efficiently. It is commonly used in electronics, computers, medical equipment, and sensor applications.
The ATS-05D-57-C1-R0 thermal-heat sink works on a simple principle. Heat is emitted from various high-performance components and dissipated into the air or another medium. This process is known as thermal conduction. The device itself is made up of an aluminum core, with a series of fins radiating outward from it. These fins extend outwards and increase the surface area of the device, allowing more heat to be conducted away from the components. As the heat dissipates, the air around the device cools, cooling the components as a result.
The ATS-05D-57-C1-R0 thermal-heat sink has numerous applications. It is most commonly used in high-performance components such as CPUs, GPUs, and high-end graphics cards. It can also be used to dissipate heat from servers, networking equipment, and other electronic components. In addition, it can be used in medical devices and laboratory equipment, where precise temperatures need to be maintained. Finally, it can be used to cool electronic sensors, preventing them from becoming too hot due to extreme temperatures or heavy loads.
The ATS-05D-57-C1-R0 thermal-heat sink is easy to install and maintain. There are no complicated tools or assembly required, and all that’s needed is to attach it to the components. It then draws heat away from the components, reducing the overall temperature of the system. As a result, the components are able to operate reliably and efficiently.
Overall, the ATS-05D-57-C1-R0 thermal-heat sink is an excellent choice for cooling high-performance components and reducing the temperature of systems. Its lightweight design makes for easy installation and maintenance, while its high-efficiency heat dissipation allows for reliable operation. As a result, it is one of the most popular cooling solutions available today.
The specific data is subject to PDF, and the above content is for reference