| Allicdata Part #: | ATS-05D-59-C1-R0-ND |
| Manufacturer Part#: |
ATS-05D-59-C1-R0 |
| Price: | $ 3.86 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05D-59-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.50469 |
| 30 +: | $ 3.31002 |
| 50 +: | $ 3.11535 |
| 100 +: | $ 2.92062 |
| 250 +: | $ 2.72591 |
| 500 +: | $ 2.53120 |
| 1000 +: | $ 2.48253 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.91°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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When it comes to thermal management solutions, ATS-05D-59-C1-R0 is a great choice. Thermal-Heat Sinks are designed to absorb and dissipate heat generated from electrical and electronic components into the environment. In the case of ATS-05D-59-C1-R0, it is specifically designed to provide thermal management for high power electrical and electronic components. It can handle temperatures up to 200°C and comes in two different versions - one with a built-in fan and the other without a fan.
Applications
This ATS-05D-59-C1-R0 Heat Sink is perfect for applications that require reliable and heavy-duty thermal management, such as electronic and logic power supplies and mobile phones. It is also suitable for other similar applications that require a high level of rigorous thermal management solutions. This type of heat sink is capable of improving the stability and reliability of electronic systems.
Features & Working
The ATS-05D-59-C1-R0 Heat Sink has several innovative features that make it a great choice for thermal management solutions. It has a high-heat dissipation rate and convection-style fin design which helps to efficiently dissipate the heat from the source and disperse it into the environment. The Heat Sink also utilizes a patented multi-layer technology for quick thermal management. This Multi-Layer Technology consists of a special middle-layer which helps to isolate the electronic components from intense heat. Other innovative features of this heat sink include a full aluminum construction for increased strength and durability, an innovative air intake design, and a built-in thermal protector for additional safety.
The ATS-05D-59-C1-R0 Heat Sink utilizes advanced heat sink technology to provide reliable and thermal management. The technology is designed to improve the performance of electronic components and ensure safe and reliable operation. This heat sink also optimizes the overall thermal performance of electrical and electronic components by directing the heat away from the components and dissipating it into the environment efficiently.
Advantages
The ATS-05D-59-C1-R0 Heat Sink provides several advantages over other solutions on the market. The specialized multi-layer structure helps to provide efficient thermal management and stability of the electronic components. The full aluminum construction helps to ensure its durability and strength and the thermal intake design helps to ensure maximum effectiveness of the heat sink. In addition, the built-in thermal protector ensures the safety of the components. All in all, the ATS-05D-59-C1-R0 Heat Sink is a great choice for providing reliable and efficient thermal management for high power electronic components.
The specific data is subject to PDF, and the above content is for reference