| Allicdata Part #: | ATS-05D-70-C1-R0-ND |
| Manufacturer Part#: |
ATS-05D-70-C1-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05D-70-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.69°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices that are designed to evenly dissipate heat from one place to anther. They are most often used to dissipate the heat generated by electronic components. The ATS-05D-70-C1-R0 is a type of heat sink that is designed for use in a variety of applications, including computers, telecommunications, military equipment, lighting, and consumer electronics. This article will discuss the application field and working principle of this heat sink.
The ATS-05D-70-C1-R0 has several features that make it well-suited for a variety of applications. Its compact size and light weight make it ideal for applications where space is limited and weight is a concern. It is constructed from premium grade metal which gives it superior corrosion resistance and excellent thermal performance. The design also ensures that the dissipated heat will spread evenly throughout the heat sink. This helps reduce hotspots and improves the overall performance of the device.
This heat sink\'s wide application field makes it suitable for use in many different areas. The most common applications for the ATS-05D-70-C1-R0 are computers, telecommunications, military equipment, and lighting. The heat sink can also be used in consumer electronics such as smartphones, tablets, digital cameras, and GPS systems. Additionally, it can be used in medical equipment, automotive applications, process automation systems, and more.
The ATS-05D-70-C1-R0 works by using two distinct thermal engines. The first thermal engine is based on a thermoelectric design where the heat generated from the device is conducted away through a metal material. The second engine uses a liquid coolant system which pumps the heat away from the device and into an external radiator. This eliminates hotspots that can cause damage to the device and the surrounding equipment. By using two distinct thermal engines, the heat sink ensures that the optimal amount of heat is dissipated to ensure that the device functions properly.
In summary, the ATS-05D-70-C1-R0 is a thermal - heat sink that is designed for use in a variety of applications. It is constructed from premium grade metal which gives it superior corrosion resistance and excellent thermal performance. This heat sink can be used in computers, telecommunications, military equipment, lighting, and consumer electronics, as well as in medical equipment, automotive applications, process automation systems, and more. The two thermal engines ensure that the optimal amount of heat is dissipated to ensure that the device functions properly.
The specific data is subject to PDF, and the above content is for reference