| Allicdata Part #: | ATS-05D-82-C3-R0-ND |
| Manufacturer Part#: |
ATS-05D-82-C3-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05D-82-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.37617 |
| 30 +: | $ 3.28503 |
| 50 +: | $ 3.10250 |
| 100 +: | $ 2.91999 |
| 250 +: | $ 2.73748 |
| 500 +: | $ 2.64622 |
| 1000 +: | $ 2.37248 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.97°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has always been a concern in the electronic industry, especially for applications such as data centers, medical devices, and consumer products, among others. Heat sinks promote more efficient cooling and higher performance, and the ATS-05D-82-C3-R0 is no exception in this regard. This article aims to provide an overview of the application field and working principle of this heat sink.
The ATS-05D-82-C3-R0 is a type of flat oval-shaped heat sink designed for optimal performance in integrated circuit applications. It features a blue anodized finish and lightweight construction, making it a great choice when thermal management needs to be efficient and low-profile. The heat sink is made of high-grade aluminum with internal fins that increase its surface area, allowing it to dissipate heat more effectively.
The application field of the ATS-05D-82-C3-R0 is diverse and includes various electronic devices and subsystems, such as mobile phones, computer systems, and both consumer and motor-driven applications. It is also commonly used for medical systems and instruments, as well as for control systems and telecommunications equipment. The heat sink can be used in both air-cooled and liquid-cooled environments.
The ATS-05D-82-C3-R0 is designed to maximize heat dissipation, efficiency, and durability. It works by using the thermal conductivity of its materials – mainly the aluminum – to draw heat away from the component and dissipate it into the surrounding environment. The external fins also add surface area, which increases the sink\'s total heat dissipation capabilities while keeping its overall size and weight lower than that of an all-aluminum heat sink.
The ATS-05D-82-C3-R0 is equipped with an optimized thermal performance curve that can be tailored to the specific component it is intended for. This allows for a tailored cooling solution and improved reliability from the thermal performance curve. As the heat sink dissipates heat more effectively and is lightweight, it is often used in small spaces and tight locations. Lastly, its durable construction ensures a longer product life, which adds to its overall value.
In summary, the ATS-05D-82-C3-R0 thermal management solution offers an efficient and reliable way to dissipate heat from your integrated circuits and other components. Its lightweight, low-profile design, paired with its optimized thermal performance curve, make it a great solution for space-restricted and high-performance applications. This heat sink is cost-effective, making it a great choice for both industrial and consumer applications.
The specific data is subject to PDF, and the above content is for reference