| Allicdata Part #: | ATS-05E-11-C1-R0-ND |
| Manufacturer Part#: |
ATS-05E-11-C1-R0 |
| Price: | $ 3.37 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05E-11-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.06684 |
| 30 +: | $ 2.98431 |
| 50 +: | $ 2.81849 |
| 100 +: | $ 2.65268 |
| 250 +: | $ 2.48686 |
| 500 +: | $ 2.40397 |
| 1000 +: | $ 2.15528 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.77°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is becoming an increasingly important factor in modern technological applications. Heat sinks are an important thermal management device that are used to dissipate heat away from critical electronic components. The ATS-05E-11-C1-R0 is an example of a heat sink designed to meet the modern requirements for heat transfer.
The ATS-05E-11-C1-R0 is a low profile aluminum heat sink used for both component cooling and air-cooling. It features an innovative fin design with a highly efficient heat dissipation capability. The fins on the heat sink are specially designed to provide maximum surface area exposure for efficient air circulation and neat mounting. The product also features a low profile design for installation in confined spaces, and a special slit design to facilitate easy installation. Furthermore, the ATS-05E-11-C1-R0 is compliant with RoHS and WEEE regulations.
This heat sink is designed to be used in a variety of applications, such as LED lighting, telecommunication equipment, medical equipment, and other high temperature electronic devices. It works by efficiently transferring heat from the heat source, such as an electronic component, to the ambient air. The fins on the heat sink act as a large surface area to dissipate the heat away from the device, while the air-flow pushed by a fan helps to carry the heat away from the device. This process helps to prevent the temperature of the device from rising too high and thus avoids potential damage.
The installation of the ATS-05E-11-C1-R0 heat sink is fairly easy and requires minimal effort. It is designed to fit the majority of standard mounting holes and can be mounted in a few minutes using simple tools. The product includes thermal mounting tape for securing the heat sink to the device. Additionally, the product comes with a set of screws and nuts for mounting to the fan or other hardware.
In conclusion, the ATS-05E-11-C1-R0 is a reliable, cost-effective heat sink choice for use in a wide variety of applications. This heat sink is designed to provide efficient heat transfer and prevent possible damage due to overheating. It is also easy to install and comes with all the necessary components for ease of use. The low profile design and its compliance with the latest European regulations make it an excellent choice for those looking for an effective, economical, and reliable heat sink for their electronic components.
The specific data is subject to PDF, and the above content is for reference