| Allicdata Part #: | ATS-05E-116-C3-R0-ND |
| Manufacturer Part#: |
ATS-05E-116-C3-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05E-116-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
The ATS-05E-116-C3-R0 is a type of thermal management device. It is essentially an interconnected system of metal components that utilizes the principals of convection and radiation to absorb, distribute, and dissipate heat generated in electrical and electronic circuits.
Function Overview
Heat sinks are typically made up of a series of fins, plates, and channels and are made out of high thermal conductivity metals such as aluminum, copper, or steel. Heat sinks are essential to any type of electrical/electronic device, such as computers, home appliances, and industrial equipment, as they can absorb and dissipate the generated heat away from the components. This helps protect components from potential heat damage and allows them to run cooler and more efficiently.
ATS-05E-116-C3-R0 Application Field and Working Principle
The ATS-05E-116-C3-R0 is designed for high-power applications that require high levels of heat dissipation without compromising the efficiency and overall performance of the system. The combination of the evenly spaced fins, circular channels, and parallel plates act in concert to absorb the heat and transfer it away from the device. This is accomplished through two methods of heat transfer, convection and radiation.
Convection
Heat energy is transferred away from the component and into the air around it by convection. This mode of heat transfer typically involves the air surrounding the component or heat sink becoming hotter and lighter, allowing it to rise and carrying the heat energy away from the component. This rising air is then replaced by cooler air, thus continuing the cycle. This cycle allows the component to remain cool while ensuring that the air around it is at a comfortable temperature.
Radiation
This mode of heat transfer involves the emission of electromagnetic radiation produced by the device. This radiation is then absorbed by the surrounding air, preventing the heat from building up in the device itself. The combination of convection and radiation allows for effective heat transfer away from the device, helping to maintain optimal operating temperatures.
Conclusion
The ATS-05E-116-C3-R0 is an excellent example of how thermal management devices can effectively control the heat generated from electrical and electronic equipment. Utilizing a combination of convection and radiation, this particular device is able to effectively transfer and dissipate all the heat produced away from the component and ensure that the device remains cool and efficient. With this in mind, the selection of the right thermal management device can make all the difference when it comes to the overall performance and efficiency of any electronic system.
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