| Allicdata Part #: | ATS-05E-145-C1-R0-ND |
| Manufacturer Part#: |
ATS-05E-145-C1-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05E-145-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-05E-145-C1-R0 heat sink is a reliable, durable, and cost-effective thermal management solution for many applications. It is widely used in a variety of electronics, including server, storage, and networking equipment, as well as industrial and automotive applications. This heat sink is designed to be lightweight, efficient, and easy to install.
The ATS-05E-145-C1-R0 is a type of heat sink that uses a combination of thermal conductivity and material design to improve the cooling efficiency of electronic components. This type of heat sink uses aluminum as the primary material due to its light weight, relative affordability, and excellent thermal conductivity. The heat sink also utilizes a series of fins with grooves in them to create a series of air columns, which increases the surface area exposed to the air and increases the sink\'s thermal dissipation capabilities.
The working principle of the ATS-05E-145-C1-R0 is fairly simple and involves two main components — the heat sink base and the heat sink fins. The base is typically made of aluminum and is used to distribute heat away from the component to be cooled. The heat sink fins are attached to the base and create air columns to further improve the sink\'s cooling capabilities.
To achieve maximum cooling efficiency, the heat sink must be mounted properly. In most cases, this involves mounting the base to the circuit board and using thermal paste to ensure maximum heat conduction. The fins are then attached to the base with a clip or screws to ensure that the fins stay in place during operation.
Once installed, the heat sink will actively move heat away from the components it is meant to cool. This is done by passively moving hot air away from the component and using the fan-like fins to draw cool air into the air columns. This helps to dissipate heat from the component quickly and effectively.
The ATS-05E-145-C1-R0 is an ideal thermal management solution for many applications, including gaming PCs, industrial automation systems, and telecommunications equipment, as well as computers and other data-centric devices. Its combination of high thermal efficiency, lightweight design, and easy installation make it an ideal choice for many heat-generating applications.
The specific data is subject to PDF, and the above content is for reference