ATS-05E-157-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.181" (30.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.35°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction

Thermal heat sinks are used to dissipate heat caused by heat generated by electrical components such as microprocessors and other electronic parts. The most commonly used thermal heat sink is the ATS-05E-157-C2-R0. It is a highly efficient heat sink that is typically used in applications that produce high levels of heat. This article will discuss the application field of the ATS-05E-157-C2-R0 and its working principle.

Application Field of the ATS-05E-157-C2-R0

The ATS-05E-157-C2-R0 is a high-efficiency thermal heat sink that is suitable for applications that require the dissipation of higher than normal levels of heat. The ATS-05E-157-C2-R0 is commonly used in applications that require high power output and have high thermal dissipation requirements, such as switching power supplies, solid-state relays, and power supplies. These applications often require heat sinks with low thermal resistance, high power density, and high thermal dissipation capacity.The ATS-05E-157-C2-R0 is also often used in applications that require high-efficiency cooling, such as medical x-ray equipment and high-power lasers. These applications require the use of a thermal cooling system that is highly efficient and can dissipate the increased amounts of heat generated by the system. The ATS-05E-157-C2-R0 is designed to achieve this goal and can meet the thermal demands and efficiencies required by these applications.

Working Principle of the ATS-05E-157-C2-R0

The ATS-05E-157-C2-R0 is designed to be highly efficient by utilizing a combination of two main technologies: convection and conduction. Convection is an efficient method of heat transfer that utilizes natural air circulation to move air around the heat source, which helps to quickly dissipate the heat. The ATS-05E-157-C2-R0 utilizes a series of fins and fins backed plates to effectively increase surface area and thus maximize convection cooling efficiency.The ATS-05E-157-C2-R0 also utilizes conduction to dissipate heat more quickly and efficiently. Conduction is a process in which heat is transferred through direct contact between two objects. The ATS-05E-157-C2-R0 utilizes a thick base with multiple channels to ensure direct contact between the heat source and the heat sink, resulting in high efficiency conduction. This direct contact also helps to reduce thermal resistance, which further improves the heat sink\'s efficiency.

Conclusion

The ATS-05E-157-C2-R0 is a highly efficient thermal heat sink that is suitable for applications that produce higher levels of heat. It is designed to utilize a combination of convection and conduction to efficiently dissipate heat. The ATS-05E-157-C2-R0 is often used in power supply, medical X-ray, and laser applications. It is a reliable and efficient thermal solution for these applications.

The specific data is subject to PDF, and the above content is for reference