| Allicdata Part #: | ATS-05E-159-C1-R0-ND |
| Manufacturer Part#: |
ATS-05E-159-C1-R0 |
| Price: | $ 3.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05E-159-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.23379 |
| 30 +: | $ 3.14622 |
| 50 +: | $ 2.97133 |
| 100 +: | $ 2.79657 |
| 250 +: | $ 2.62181 |
| 500 +: | $ 2.53441 |
| 1000 +: | $ 2.27223 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-05E-159-C1-R0 is an effective thermal management solution for applications requiring large area heat dissipation. Specifically designed and constructed to absorb heat in high intensity concentrations, it is especially suited for applications needing air flow, including industrial computers, laboratories, laboratories with laser scanning and related instruments, video express cards, and digital devices that feature chipset sets such as Intel, AMD, or Nvidia.
The thermal management solution incorporates a split-flow design to maximize heat dissipation. ATS-05E-159-C1-R0 features two large heat sinks connected to a common bulkhead. This allows for improved air circulation around both heat sinks and dissipates heat more efficiently than single-heat sinks. The split-flow design helps to reduce fan noise and prolongs the life of the fan.
The design also features four mounting supports to ensure secure and stable installation. Additionally, the thermal management solution includes integrated installation hardware and special cutouts for multiple fan sizes. This makes it ideal for use in narrow spaces with limited space for traditional fan mounts.
ATS-05E-159-C1-R0 is optimized for use with an Intel Direct Pipe Heat Exchanger. The exchanger features a high-efficiency design and moves up to 35 percent more heat away from the processor. This results in improved thermal performance and stability for intensive applications.
The thermal performance of ATS-05E-159-C1-R0 is further enhanced by its unique shape. This shape helps to direct the flow of the air over the heat sinks in a more efficient manner. This ensures that the air reaches the heat sinks more rapidly and with increased velocity. This helps to keep the temperature of the heat sinks lower and enhances the overall performance.
ATS-05E-159-C1-R0 is also designed to provide a low-cost and reliable thermal solution for commercial and industrial applications. It is constructed from lightweight aluminum and features an enhanced heat sink design to maximize the thermal performance. Additionally, it is simple to install and requires minimal maintenance costs. The advanced heat sink design also ensures that ATS-05E-159-C1-R0 operates at an optimal temperature even when running in extreme environments.
The thermal management solution provides effective thermal performance for a wide variety of applications. It can be used in industrial computers, laboratories, and even digital devices. The advanced heat sink design and low-cost solution make ATS-05E-159-C1-R0 an ideal choice for any application that requires reliable and efficient cooling. This makes it an ideal option for large areas where air cooling is not possible.
The specific data is subject to PDF, and the above content is for reference