| Allicdata Part #: | ATS-05E-161-C1-R0-ND |
| Manufacturer Part#: |
ATS-05E-161-C1-R0 |
| Price: | $ 3.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05E-161-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.41208 |
| 30 +: | $ 3.31968 |
| 50 +: | $ 3.13526 |
| 100 +: | $ 2.95079 |
| 250 +: | $ 2.76641 |
| 500 +: | $ 2.67419 |
| 1000 +: | $ 2.39754 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.72°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a type of thermal management technology most commonly used on electronic components that require dissipation of large amounts of heat. Heat sinks are a passive heat exchanger that transfers the heat generated by an electronic component or device to a coolant fluid or gas. The heat is dissipated into the component or device, or absorbed and dissipated by a heat sink which then disperses the heat away from the source. ATS-05E-161-C1-R0 is one of the most efficient thermal components available. It is designed to maximize cooling efficiency at maximum power.
ATS-05E-161-C1-R0, an efficient thermal heat sink, is designed to efficiently dissipate up to 160 watts of heat. The device features a rugged, highly efficient, and cost-effective aluminum construction that is ideal for a wide variety of applications. The aluminum construction works in concert with an advanced, liquid-crystal polystyrene (LCPS) thermal control material to increase cooling efficiency with minimal thermal resistance. The design also allows for easy installation and integration. This thermal solution also boasts a low profile design that fits into tight, height-restricted spaces and is easy to install. The compact design and low profile make it suitable for use in a wide variety of applications. This thermal solution is ideal for data centers, medical and sensing devices, communications and instrumentation and industrial and power supply markets.
ATS-05E-161-C1-R0 is designed to be used in a wide variety of applications. Heat sinks are most commonly used in components such as CPUs, GPUs, and other electronic components that generate large amounts of heat. By dissipating this heat away from the source, the device helps to prevent overheating and ensure reliable operation. Heat sinks are also used to dissipate heat from radiators and other thermal components, such as LED lighting, to help maintain optimal operating temperatures. This heat sink can also be used in a wide variety of industrial applications, such as power supplies, proximity sensors, laser diodes, and displays.
ATS-05E-161-C1-R0 works by transferring the heat generated by an electronic component or device to the liquid-crystal polystyrene (LCPS) thermal control material. This material absorbs the heat and dissipates it away from the heat source. The aluminum construction of the heat sink helps to efficiently dissipate the heat away from the source, preventing overheating and allowing for reliable operation. This type of heat sink is designed to offer maximum cooling efficiency at maximum power and is one of the most efficient thermal components available.
In conclusion, ATS-05E-161-C1-R0 is an efficient thermal heat sink designed to maximize cooling efficiency to prevent overheating and provide reliable operation for a variety of applications. It features a rugged, highly efficient, and cost-effective aluminum construction that works with an advanced LCPS thermal control material to effectively dissipate the heat away from the source. Additionally, the device features a low profile design that fits into height-restricted spaces. This makes it suitable for a variety of applications, from data centers to industrial and power supply markets. With its advanced design and ability to offer efficient cooling, this thermal heat sink is one of the most efficient components available.
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