| Allicdata Part #: | ATS-05E-173-C1-R0-ND |
| Manufacturer Part#: |
ATS-05E-173-C1-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05E-173-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential to maintain the reliability and design integrity of a wide range of products, from high-performance computer systems to home appliances. Heat sinks exist to manage the thermal energy generated by the components contained within a system, such as processors. The ATS-05E-173-C1-R0, a thermal-heat sink, is designed to provide effective cooling for such applications.
The ATS-05E-173-C1-R0 thermal-heat sink comes in a range of sizes and configurations designed to accommodate a variety of needs. It is constructed from uncoated aluminum alloy, which has a low thermal conductivity and high heat capacity, making it ideal for thermal management applications. Additionally, the aluminum alloy is lightweight, making the ATS-05E-173-C1-R0 an excellent choice for applications where size, weight, and/or cost are a concern.
The ATS-05E-173-C1-R0 features a number of design features that contribute to its effective heat dispersion and energy conservation. The outside of the sink is ribbed to help increase surface area and maximize air flow. Additionally, the center of the sink is cut out, allowing air to move more freely and dissipate heat from the component. The base is recessed, allowing for a larger contact area between the sink and the component, which further increases its heat dispersion capability.
The ATS-05E-173-C1-R0 can be used to cool processors, chipsets, memories, and other high-performance components. It is designed to optimize the flow of air together with its surface area, maximizing the ability to dissipate heat from the component into the ambient environment. Additionally, its self-pressurizing design negates the need for any external cooling devices such as fans, resulting in a more reliable system with improved heat dissipation capabilities.
The ATS-05E-173-C1-R0 is an efficient thermal-heat sink designed to maximize the dissipation of heat generated by components contained within a system. It is constructed from lightweight uncoated aluminum alloy that dissipates heat quickly into the ambient environment and can be paired with other cooling devices for enhanced performance. The ATS-05E-173-C1-R0 is a cost effective and reliable cooling solution for a variety of applications.
The specific data is subject to PDF, and the above content is for reference