| Allicdata Part #: | ATS-05E-176-C1-R0-ND |
| Manufacturer Part#: |
ATS-05E-176-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05E-176-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.56°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal – Heat Sinks are widely used in the cooling of electronic devices. They are typically made from aluminum or copper to help dissipate the heat from the device. The ATS-05E-176-C1-R0 Heat Sink is a specific type of Thermal – Heat Sink that is used for cooling components in electronic devices. In this article, we will look at the application field and working principle of the ATS-05E-176-C1-R0 Heat Sink.
The ATS-05E-176-C1-R0 Heat Sink is typically used in consumer electronic products such as cell phones, laptops, PDAs, portable gaming systems, and other similar devices. It is also used in industrial and commercial applications such as lighting, automotive, and HVAC systems. The Heat Sink is designed to transfer heat away from sensitive components such as processors, memory chips, and voltage regulators. It is made of a thin aluminum or copper base which is cooled by external cooling fins.
The working principle of the ATS-05E-176-C1-R0 Heat Sink is based on two principles: conduction and convection. Conduction is the process of heat transfer from a warmer entity to a cooler one by touching. The aluminum or copper base material of the Heat Sink conducts the heat away from the components of the device. Convection is the process of heat transfer from a hotter material to a cooler one when they are not in direct contact. In the case of the ATS-05E-176-C1-R0 Heat Sink, the external cooling fins transfer the heat away from the device when air is blown across the fins.
The ATS-05E-176-C1-R0 Heat Sink is a reliable and effective way to cool components in consumer electronics, automotive, industrial, and commercial applications. It is made of a thin aluminum or copper base material which conducts the heat away from the components and is cooled by external cooling fins that transfer the heat away from the device when air is blown across them. With its sturdy construction, efficient heat dissipation structure, and superior cooling performance, the ATS-05E-176-C1-R0 Heat Sink offers a reliable cooling solution for many electronic applications.
The specific data is subject to PDF, and the above content is for reference