| Allicdata Part #: | ATS-05E-186-C3-R0-ND |
| Manufacturer Part#: |
ATS-05E-186-C3-R0 |
| Price: | $ 4.43 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X35MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05E-186-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.99042 |
| 30 +: | $ 3.76887 |
| 50 +: | $ 3.54715 |
| 100 +: | $ 3.32545 |
| 250 +: | $ 3.10376 |
| 500 +: | $ 2.88206 |
| 1000 +: | $ 2.82664 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-05E-186-C3-R0 is a thermal-heat sink that is widely used in numerous applications. One of the most common uses of the ATS-05E-186-C3-R0 is to dissipate the heat generated during the operation of electronic components and devices. As a result, it is often used in the production of semiconductor products and components.
The ATS-05E-186-C3-R0 is designed to be both effective and efficient. It is constructed from aluminum alloy material that has been treated to be durable and lightweight. The device is also anodized to provide further protection against corrosion and wear. The design of the ATS-05E-186-C3-R0 ensures that heat is conducted away from electronic components to the surface of the heat sink quickly and efficiently.
The working principle of the device is based on the concept of thermal energy transfer. As heat is generated within the electronic components, the heat travels through the metal of the ATS-05E-186-C3-R0 to the surface of the heat sink. The heat is then dissipated into the air around the device, which helps to keep the temperature of the components regulated. The heat sink is also designed to reduce the amount of noise that is created due to vibration, which in turn helps to improve the components’ performance.
The ATS-05E-186-C3-R0 is suitable for use in a variety of applications. It is most commonly used in the production of semiconductors such as integrated circuits, but it can also be used to dissipate the heat generated by digital circuits and radio frequency components. Additionally, the device can be used in the production of LEDs, displays, and other electronic components.
In conclusion, the ATS-05E-186-C3-R0 is a thermal-heat sink that is designed to be both effective and efficient. It uses the concept of thermal energy transfer to dissipate the heat generated by electronic components quickly and efficiently. Additionally, the device is suitable for use in a variety of applications, ranging from semiconductor production to LED and digital circuit cooling. It is an effective and reliable solution for managing the heat generated by electronic components and devices.
The specific data is subject to PDF, and the above content is for reference