| Allicdata Part #: | ATS-05E-199-C3-R0-ND |
| Manufacturer Part#: |
ATS-05E-199-C3-R0 |
| Price: | $ 3.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X6MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05E-199-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.41208 |
| 30 +: | $ 3.31968 |
| 50 +: | $ 3.13526 |
| 100 +: | $ 2.95079 |
| 250 +: | $ 2.76641 |
| 500 +: | $ 2.67419 |
| 1000 +: | $ 2.39754 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.95°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management products like ATS-05E-199-C3-R0 are used in electronic applications to dissipate heat generated by components. Heat sinks are an important thermal management tool and are often used in combination with other components such as fans, radiators and heat pipes. Traditional heat sinks, such as ATS-05E-199-C3-R0, rely on conduction to transfer heat from the device to the heat sink. The device to be cooled is in direct contact with the heat sink, and the heat from the device is transferred directly to the heat sink.
The ATS-05E-199-C3-R0 heat sink is designed for quick and efficient removal of heat from devices that require high-performance cooling. It is a type of metal-finned heat sink with high-frequency fin shaping, made of copper, designed to provide maximum thermal performance. The design provides an efficient surface-to-air heat transfer, eliminating the need for complicated internal passages. The fin pitch of ATS-05E-199-C3-R0 is optimized for maximum thermal performance.
The thermal performance of ATS-05E-199-C3-R0 is further enhanced by the use of extruded linear fins that help increase the surface area and the volume of air circulating around the fins. The fins are also designed to minimize flow stagnation, allowing air to move freely around the fins and maximizing the heat dissipation. With high-frequency fin shaping, the fin pitch of ATS-05E-199-C3-R0 is optimized for maximum thermal performance and airflow resistance is minimized.
ATS-05E-199-C3-R0 heat sink is suitable for many electronic applications, such as high-power resistors, transistors, and power transistors. It can also be used in combination with a fan to provide additional cooling. The heat sink is designed for easy installation in a wide variety of applications and can be mounted on most surfaces. It also features an integrated fan mount for mounting a fan.
ATS-05E-199-C3-R0 is designed for both safety and efficiency in cooling applications. It has a low thermal resistance, which means that heat can be efficiently transferred from the device to the heat sink, and the high thermal conductivity of the copper ensures that heat is dissipated quickly and efficiently. It features a durable construction, designed to be resistant to vibration or shock and offers excellent heat transfer and heat dissipation. Additionally, the heat sink is RoHS compliant, meaning it is free of hazardous substances and meets European environmental standards.
With a high thermal performance, low thermal resistance and a durable construction, ATS-05E-199-C3-R0 is an ideal choice for a wide range of cooling applications. The heat sink is easy to install and provides a reliable and efficient solution for keeping components at the right temperature, allowing them to operate at their best. With its efficient and durable design, ATS-05E-199-C3-R0 is an excellent choice for thermal management applications.
The specific data is subject to PDF, and the above content is for reference