ATS-05E-20-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-05E-20-C1-R0-ND

Manufacturer Part#:

ATS-05E-20-C1-R0

Price: $ 3.99
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-05E-20-C1-R0 datasheetATS-05E-20-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.62061
30 +: $ 3.41922
50 +: $ 3.21817
100 +: $ 3.01701
250 +: $ 2.81588
500 +: $ 2.61474
1000 +: $ 2.56446
Stock 1000Can Ship Immediately
$ 3.99
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.13°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal management is critical when it comes to electronic systems. Heat sinks help dissipate heat from components in order to keep the system running as efficiently as possible. One type of thermal solution is the ATS-05E-20-C1-R0 heat sink. This article provides an overview of the application field and working principle of this product.

Application Field of ATS-05E-20-C1-R0 Heat Sink

The ATS-05E-20-C1-R0 heat sink is designed to dissipate heat from sensitive electronic components and systems. It is utilized in a wide range of industries, including military, automotive, telecommunications, medical, and consumer electronics. It is typically used in extreme environments, such as those with high ambient temperatures or with wide fluctuations in temperature.

This heat sink provides effective heat dissipation in high-density systems. It is widely used in systems such as laser diode, light emitting diode (LED), and other solid-state lighting, as well as in ICs. It is also suitable for high-power components, including power transistors and power integrated circuits (ICs).

Working Principle of ATS-05E-20-C1-R0 Heat Sink

The ATS-05E-20-C1-R0 heat sink utilizes dynamic convection technology to dissipate heat. This technology uses the motion of air under the influence of gravity to transfer heat away from the heat sink. It works by taking advantage of the fact that heated air is lighter than colder air. The lighter air rises and the cooler air falls, causing a convective cycle of air flow.

The ATS-05E-20-C1-R0 heat sink is designed in such a way that the air flows in a laminar pattern. This helps to ensure that the ambient temperature is not affected by the heat sink. The heat sink also features multiple intake and exhaust ports, which allows air to pass through the heat sink from multiple directions. This evenly distributes heat away from the heat sink, increasing the overall efficiency of heat dissipation.

The ATS-05E-20-C1-R0 also utilizes a finned design to maximize surface area and increase the rate of heat dissipation. The fins are specifically designed to be low profile, allowing the heat sink to be mounted in tight spaces. The fins also feature shallow sloped edges, which helps to reduce noise levels.

In addition, the ATS-05E-20-C1-R0 utilizes a special die-cast aluminum construction, which provides high thermal conductivity and excellent mechanical strength. The design also features corrosion resistant properties, which helps to ensure the longevity of the heat sink in extreme environmental conditions.

Conclusion

The ATS-05E-20-C1-R0 heat sink is a versatile and reliable thermal management solution for a wide range of applications. It utilizes dynamic convection technology, multiple intake and exhaust ports, and a finned design to effectively dissipate heat away from electronic components. The aluminum construction also ensures the heat sink is corrosion resistant and highly durable. As such, the ATS-05E-20-C1-R0 is a great choice for any application that requires effective heat dissipation.

The specific data is subject to PDF, and the above content is for reference

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