ATS-05E-20-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-05E-20-C3-R0-ND

Manufacturer Part#:

ATS-05E-20-C3-R0

Price: $ 4.67
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-05E-20-C3-R0 datasheetATS-05E-20-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.19895
30 +: $ 3.96543
50 +: $ 3.73225
100 +: $ 3.49896
250 +: $ 3.26570
500 +: $ 3.03243
1000 +: $ 2.97412
Stock 1000Can Ship Immediately
$ 4.67
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.21°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an essential part of any electronic device or system. Heat sinks provide the means to effectively dissipate the heat generated by the operational components of the system. The ATS-05E-20-C3-R0 is a type of heat sink commonly used for thermal management in a wide variety of applications. This article will provide an overview of the ATS-05E-20-C3-R0, touching on its application field and working principle.

The ATS-05E-20-C3-R0 is an extruded aluminum heat sink with an anodized aluminum finish that is designed to meet MIL-STD-810F requirements. It is manufactured to provide high-quality thermal transfer performance over an extended period of time. The extruded aluminum ensures that the heat sink has an optimal design allowing it to effectively manage heat generated by a wide range of components, including CPUs, GPUs and LEDs.

The ATS-05E-20-C3-R0 is a versatile heat sink, capable of cooling electronic components in a wide array of applications. These include medical technical systems, telecommunications, automotive, industrial automation and aviation systems. The heat sink is designed to be used with components that generate a wide range of thermal loads. It is also designed to be easily adapted to fit the existing footprints of the components, allowing the manufacturer to minimize changes to their existing designs and providing a cost-effective solution.

The ATS-05E-20-C3-R0 features fins and a central tower that are spaced to maximize thermal transfer performance. The fins are designed to draw air away from the component and divert the heat generated away from the components, allowing it to remain cool and operational. The fins are also designed in such a way to allow air to move over the fins and provide a cooling effect to the component. The central tower is used to further improve thermal transfer, allowing heat to be dissipated faster.

The ATS-05E-20-C3-R0 is a reliable heat sink that is designed to provide maximum thermal performance over an extended period of time. The use of extruded aluminum ensures that the heat sink is strong and durable enough to withstand the harshest application environments. The heat sink also features an anodized aluminum finish, providing it with superior corrosion resistance and protection against wear and tear.

The ATS-05E-20-C3-R0 is an effective heat sink designed to cool components in a wide range of applications. Its extruded aluminum construction and anodized aluminum finish provide superior thermal transfer performance, durability and protection. Furthermore, its versatile design allows it to fit existing components, provide a cost-effective solution and ensure long-lasting performance.

The specific data is subject to PDF, and the above content is for reference

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