| Allicdata Part #: | ATS-05E-200-C1-R0-ND |
| Manufacturer Part#: |
ATS-05E-200-C1-R0 |
| Price: | $ 3.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05E-200-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.94840 |
| 30 +: | $ 2.86860 |
| 50 +: | $ 2.70925 |
| 100 +: | $ 2.54986 |
| 250 +: | $ 2.39047 |
| 500 +: | $ 2.31079 |
| 1000 +: | $ 2.07174 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.76°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are prevalent in many industries and have a wide range of applications. Used to transfer thermal energy away from hot objects for cooling, heat sinks are commonly found in computer systems, ventilation and air conditioning (HVAC) systems, and electronics. In addition, some thermal control elements, such as thermoelectric cooling (TEC) modules, require heat sinks for proper thermal management.
ATS-05E-200-C1-R0 is a high-performance heat sink for cooling applications that require maximum cooling efficiency. This heat sink has a low profile design and features a highly efficient heat transfer system that utilizes a combination of pin-fin and flat-fin surfaces for improved cooling capabilities. The ATS-05E-200-C1-R0 is designed to operate within a 200°C to 390°C range and offers a thermal resistance of up to 0.05°C/W.
The ATS-05E-200-C1-R0 is a thermal-electric cooler (TEC) module that utilizes a combination of a finned heat sink and a thermoelectric module. The thermoelectric module is comprised of two P-type and two N-type semiconductor elements that are connected to a heatsink. When current is applied to the thermoelectric elements, one side of the module heats up while the other side cools. This creates a temperature differential between the two sides of the module and a saddle-like temperature gradient is formed. The saddle-like temperature gradient is used to efficiently transfer heat from the hot side to the cold side of the module.
The heat generated by the thermoelectric elements is dissipated by the heat sink which is made up of a series of fins. The fins act as a heat sink which increases heat dissipation efficiency by transferring the thermal energy to the surrounding environment. The ATS-05E-200-C1-R0 features fins with a fin height of 2mm and a fin gap of 5mm for optimal thermal performance and high heat dissipation efficiency.
The ATS-05E-200-C1-R0 is designed for a wide range of applications such as cooling high power LEDs, liquid cooling, and industrial applications. It is also ideal for applications involving high ambient temperatures as the heat sink offers a thermal resistance of up to 0.05°C/W. The ATS-05E-200-C1-R0 is an excellent choice for those looking for an efficient and reliable heat sink with high thermal performance.
The specific data is subject to PDF, and the above content is for reference