ATS-05E-200-C3-R0

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Heat generated by electrical components requires adequate thermal management to ensure components are functioning correctly. Thermal management involves utilising different approaches and devices such as heat sinks, heat spreaders, etc. to dissipate the generated heat. One such thermal management solution is ATS-05E-200-C3-R0.

ATS-05E-200-C3-R0 belongs to the Thermal-Heat Sinks category. It is a superior single-piece aluminium heat sink featuring an impressive mechanical strength and rigidity, ideal for dissipating high power heat fluxes from electrical and electronics devices.

The structure of the ATS-05E-200-C3-R0 consists of a base plate supporting a heat sink body with an adjustable clip. The clip facilitates easy assembly of the thermal management solution without the use of additional tools, increasing the convenience for end users. The base plate is made of stainless steel, the heat sink body is machined from a single piece of aluminium and is equipped with a protruding clip which is pre-shaped for quick and secure assembly.

The base plate of ATS-05E-200-C3-R0 is fitted with multiple rectangular fins, designed to greatly increase the surface of the heat sink for maximum efficiency in the dissipation of heat fluxes. The heat sink is designed for use in power electronics devices such as power transistors, power MOSFETs, IGBTs and other components requiring adequate thermal management.

ATS-05E-200-C3-R0 is designed to be capable of transferring heat away from components quickly and efficiently. This is achieved through the use of the specialised heat sink body that features vertical fins. The vertically placed fins maximise the increase of the surface area for the entire heat sink so that more heat can be diverted away from the components. The high thermal conductivity of the aluminium also helps in this regard.

In addition, the ATS-05E-200-C3-R0 features a forced convection type air cooling mechanism. The vertical fins generate an air flow allowing air to pass through the heat sink, taking the heat away and aiding in the dissipation process. This mechanism also optimizes the performance by ensuring that the heat dissipates uniformly in the ambient. It also eliminates the risk of direct thermal contact with other exposed components which can lead to overheating and potential damage.

The increased efficiency in the heat dissipation of the ATS-05E-200-C3-R0 enables it to sustain thermal performances even at elevated temperatures. This ensures the components being cooled are able to reach their rated performance levels with no significant increase in the temperature.

The ATS-05E-200-C3-R0 is suitable for use in a range of applications such as automotive, LED, telecom, defense, and industrial. Its ability to dissipate heat quickly and efficiently ensures that it can be used in a number of scenarios to avoid the risk of overheating. The clip allows for easy assembly, and its superior mechanical strength and rigidity ensure that the design is reliable while providing enhanced performance.

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