| Allicdata Part #: | ATS9895-ND |
| Manufacturer Part#: |
ATS-05E-206-C2-R0 |
| Price: | $ 5.05 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05E-206-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.58640 |
| 10 +: | $ 4.46481 |
| 25 +: | $ 4.21672 |
| 50 +: | $ 3.96875 |
| 100 +: | $ 3.72065 |
| 250 +: | $ 3.47261 |
| 500 +: | $ 3.22456 |
| 1000 +: | $ 3.16256 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.71°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are devices used to draw heat away from another element, usually a heat-producing electronic component. Heat sinks come in a variety of shapes and sizes and can be made from materials such as copper, aluminum and even plastic. The ATS-05E-206-C2-R0 heat sink is one of the most popular heat sinks on the market today. It is made out of aluminum and is capable of dissipating up to 600W of heat.
Application Field and Working Principle of ATS-05E-206-C2-R0
The ATS-05E-206-C2-R0 is a thermally-efficient heat sink which is ideal for applications such as high-powered computing systems, telecommunications, and other high-temperature environments. It is designed to draw heat away from the processor, motherboard, and other components while increasing the available system air flow. The primary function of the ATS-05E-206-C2-R0 is to dissipate heat from the components in the system, and ensure the proper operation of the system.
The ATS-05E-206-C2-R0 utilizes a unique heat dissipation design to provide optimal thermal performance. The main principle behind the design is called conduction cooling technology, which utilizes the metal housing of the heat sink to efficiently transfer heat away from the surface of the processor. The metal casing is designed with a combination of fins and copper heat pipes, which help to transport the heat away from the processor and dissipate it through the surface of the heat sink.
The fins on the ATS-05E-206-C2-R0 are carefully engineered to promote heat dissipation. They feature a unique design which is engineered to maximize the surface area, allowing heat to spread evenly across the entire casing of the heat sink. The fins are also arranged in a staggered pattern to maximize the airflow around the heat sink, and to help cool the internal components of the system.
The ATS-05E-206-C2-R0 also utilizes copper heat pipes to further improve the heat dissipation capabilities of the heat sink. The copper heat pipes are designed to transfer heat away from the processor and dissipate it through the fins on the surface of the heat sink. The copper heat pipes are also configured to provide efficient airflow through the surface of the heat sink, allowing the heat to be dissipated more rapidly and evenly than with traditional heat sinks.
In conclusion, the ATS-05E-206-C2-R0 is an ideal choice for anyone looking for a thermally-efficient heat sink that will provide optimal thermal performance for their system. It utilizes conduction cooling technology, combined with copper heat pipes and an efficient fin design, to provide an optimal balance of heat dissipation and airflow for any high-temperature environment.
The specific data is subject to PDF, and the above content is for reference