ATS-05E-53-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.181" (30.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.52°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-05E-53-C1-R0 is a type of thermal-heat sink used in electronic equipment. Heat sinks are designed to keep components operating within their optimal temperature range and thereby reduce the risk of overheating. The ATS-05E-53-C1-R0 is capable of dissipating 100 Watts of heat from the system and is also compatible with a variety of common connector configurations.

Application Field

The ATS-05E-53-C1-R0 is used in a wide range of electronic assemblies, including remote monitoring, automation, telecommunications, lighting and signage, automotive, medical, and other applications. It is used to prevent component overheating, reducing their energy consumption and increasing system efficiency and lifespan. The ATS-05E-53-C1-R0 is designed for extreme temperature applications, and it can operate in temperatures ranging from -40°C (-40°F) to 125°C (257°F).

Design and Materials

The ATS-05E-53-C1-R0 is constructed with aluminum alloy material, which ensures the highest level of thermal performance. It is a highly efficient heat dissipating device as it is fabricated with a number of fins which provide a greater area for heat to dissipate from the system. The fins are made from a special anodized aluminum that is corrosion-resistant. The device also features standard pass-through connections which allow for easy integration into most electronic systems.

Working Principle

The ATS-05E-53-C1-R0 uses convection to dissipate the heat from the system. Convection occurs when a warm pocket of air rises and is replaced by a cooler pocket of air. This air movement causes a transfer of heat from the system which is then dissipated into the atmosphere. The aluminum alloy construction and the fin design of the ATS-05E-53-C1-R0 act to maximize the surface area of the heat sink, thus increasing the rate of convective heat flow between the device and the surrounding air.

Conclusion

The ATS-05E-53-C1-R0 thermal-heat sink is designed to dissipate up to 100 watts of heat from electronic devices and components. It is constructed with aluminum alloy material and a unique fin design that maximizes the surface area for heat transfer. The ATS-05E-53-C1-R0 is capable of operating in temperatures ranging from -40°C (-40°F) to 125°C (257°F). These features make it suitable for a wide range of applications, and it is an effective way to prevent electronic components from over-heating.

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