| Allicdata Part #: | ATS-05E-59-C3-R0-ND |
| Manufacturer Part#: |
ATS-05E-59-C3-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X30MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05E-59-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.88647 |
| 30 +: | $ 3.67059 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are mechanical components used in electronic devices and equipment to manage thermally-induced problems. Heat sinks serve as passive mechanisms that transfer thermal energy generated by an electronic or mechanical device away from the device and into their environment. Heat sinks use convection or conduction to dissipate heat, or a combination of both. ATS-05E-59-C3-R0, a thermal heat sink, is a popular choice for a wide range of applications.
ATS-05E-59-C3-R0 has a so-called extruded fin heat sink design with a single-fin design on both sides. The one-fin design on both sides gives the ATS-05E-59-C3-R0 a very wide surface area, making it highly efficient in dissipating heat away from the source. The aluminum material used to construct the ATS-05E-59-C3-R0 provides excellent thermal conductivity, dispersing heat to the surrounding environment.
The ATS-05E-59-C3-R0 features a low profile which reduces the amount of total sink size, ideal for tight spaces and small form-factor applications. The sink is also very lightweight, providing for a low power requirement. The design is also corrosion-resistant, able to withstand long-term exposure to environmental elements such as moisture and sunlight.
The ATS-05E-59-C3-R0 can be used in applications such as automotive electronics, LED lighting, HVAC systems, CPUs, GPUs, and any circuit board-based electrical devices. It is suitable for use in mobile devices, air conditioning systems, industrial and medical applications, as well as data centers.
The ATS-05E-59-C3-R0 is designed to work in two main ways: convection and conduction. Through convection, the air moving around a component takes away heat via circulation. The convection process happens in either a natural or forced format; air is either provided by a fan placed onto the heat sink or provided by natural air movement in the environment.
The conduction process, on the other hand, occurs when heat is transferred from one component to another through direct contact. The aluminum material used in the ATS-05E-59-C3-R0 is an excellent conductor and transfers heat away from the source and into the heat sink.
The ATS-05E-59-C3-R0 also features an adjustable mounting system. The adjustable mounting system allows users to orient the heat sink in whatever direction they see fit and to adjust the height and angle of the sink to best fit their specific application.
Overall, the ATS-05E-59-C3-R0 thermal heat sink is an ideal solution for a wide range of industrial and commercial applications. Its wide heat dissipation surface area, low profile, lightweight design, corrosion-resistance, and adjustable mounting system make it the perfect choice for thermal management in tight spaces and high-powered applications.
The specific data is subject to PDF, and the above content is for reference