ATS-05F-04-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-05F-04-C3-R0-ND

Manufacturer Part#:

ATS-05F-04-C3-R0

Price: $ 3.75
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X20MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-05F-04-C3-R0 datasheetATS-05F-04-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.41208
30 +: $ 3.31968
50 +: $ 3.13526
100 +: $ 2.95079
250 +: $ 2.76641
500 +: $ 2.67419
1000 +: $ 2.39754
Stock 1000Can Ship Immediately
$ 3.75
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 11.70°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are an important component in many electronics devices, providing reliable cooling and heat regulation for the sensitive components. The ATS-05F-04-C3-R0 is a specialized heat sink designed to meet the toughest thermal management needs. It is a widely used component in various applications, such as advanced telecommunication, military, aerospace and medical equipment. This article will cover the application field and working principle of the ATS-05F-04-C3-R0.

The ATS-05F-04-C3-R0 is a high-performance heat sink that features a multi-layer evaporative fin design. This design is optimized to create maximum surface area for maximum cooling effectiveness. The design also helps to eliminate air bubbles and voids, making it more reliable and efficient. In addition, the fin design helps to reduce thermal resistivity, allowing for a greater air flow with less pressure. This makes it perfect for applications that require high-power or high-speed cooling performance.

The ATS-05F-04-C3-R0 is also designed to operate in extreme temperatures, ranging from -20°C to +150°C. This makes it ideal for applications that are exposed to extreme temperatures or require a wide temperature range. The advanced construction and design of this heat sink results in an enhanced durability and longer life span, making it a reliable and cost-effective solution for many applications.

The heat sink works on the principle of heat conduction. In this process, the heat is conducted away from the components and drawn away from them. This is typically achieved via a combination of conductive and convective heat transfer. With the ATS-05F-04-C3-R0, heat is conducted through the multi-layer fin design and then drawn away by the constant air flow, maintaining optimal thermal performance at all times. This ensures that the components of the device remain safe from any harmful temperature elements.

The ATS-05F-04-C3-R0 is used in various applications, such as servers, computers, scientific instrumentation, military and aerospace systems, medical equipment, lasers, communications equipment, consumer electronics, and power supplies. It is suitable for any application that needs reliable, high-performance cooling. This heat sink is also widely used in telecom facilities, data centers, and even in automotive applications.

The ATS-05F-04-C3-R0 is an advanced and reliable heat sink, offering superior thermal performance and a wide temperature range. It is designed for use in extreme and hostile environments, making it ideal for many applications. With its high-performance construction, it ensures a longer life and reliable cooling of sensitive components. This makes it an ideal choice for a wide range of applications in the electronics industry.

The specific data is subject to PDF, and the above content is for reference

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