ATS-05F-10-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-05F-10-C1-R0-ND

Manufacturer Part#:

ATS-05F-10-C1-R0

Price: $ 3.61
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-05F-10-C1-R0 datasheetATS-05F-10-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.28104
30 +: $ 3.19242
50 +: $ 3.01505
100 +: $ 2.83771
250 +: $ 2.66036
500 +: $ 2.57169
1000 +: $ 2.30565
Stock 1000Can Ship Immediately
$ 3.61
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.87°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks

ATS-05F-10-C1-R0 Application Field and Working Principle

Heat sinks are devices designed to dissipate heat away from a component or system. Heat sinks are predominantly used in electronics and computers, though they are also used in many other applications. Heat sinks are basically a passive device, and they rely on four basic properties to be effective: conduction, convection, radiation, and adiabatic.

Conductive Heat Sinks

Conductive heat sinks are the most common type of heat sink. They are designed to absorb heat from the component they are attached to and disperse it to the surrounding atmosphere. This is typically done by using a material with high thermal conductivity, such as aluminium, which can absorb heat and transfer it to the air, thereby cooling the component. Conductive heat sinks are often made in the form of fins, which increase the surface area of the heat sink and enable air to circulate around it more efficiently.

Convective Heat Sinks

Convective heat sinks work by drawing air in to the heat sink, often through the use of a fan. This draws heat away from the component, which then passes out through the sides of the heat sink. The fan increases the surface area of the fan and also helps to circulate the air around the heat sink. Convective heat sinks are used in situations where a greater amount of cooling is required, such as in computers and electronics.

Radiant Heat Sinks

Radiant heat sinks dissipate heat away via thermal radiation, meaning that they absorb heat from the component and release it in the form of infrared radiation. Radiant heat sinks are typically used in extreme-temperature applications such as lasers, military, aerospace, and medical devices.

Adiabatic Heat Sinks

Adiabatic heat sinks are designed to absorb and store heat, rather than dissipate it. This is done by using a material which absorbs heat and stores it until the temperature difference between the heat sink and the surroundings no longer creates a temperature gradient. Adiabatic heat sinks can be used in applications where heat must be stored, such as in applications which require a steady temperature to be maintained.

ATS-05F-10-C1-R0

The ATS-05F-10-C1-R0 is a small-footprint heat sink designed to provide optimal cooling performance in extreme applications. It is designed with a combination of convective, conductive, and radiative heat transfer technologies, which makes it capable of dissipating extreme amounts of heat. It also has a special micro-finned design which enables maximum surface-to-air contact and further increases its efficiency. It is designed to withstand temperatures up to +105°C and is certified to both RoHS and UL 94V-0.In conclusion, heat sinks are used in many different applications and come in many different shapes and sizes. They are especially useful for dissipating heat from components in high-performance applications. The ATS-05F-10-C1-R0 is a small-footprint heat sink designed to provide efficient cooling solutions in extreme applications. It combines several cooling technologies and uses a special micro-finned design to ensure maximum cooling efficiency.

The specific data is subject to PDF, and the above content is for reference

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