ATS-05F-106-C2-R1

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	1.772" (45.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	26.60°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are devices designed to dissipate large amounts of heat generated by hot-running electrical components, such as processors and power supplies. They serve two main functions: to reduce the temperature of the component and to protect it from environmental damage. This article will focus on the thermal management application field and working principle of the ATS-05F-106-C2-R1 heat sink.

Application Field

ATS-05F-106-C2-R1is an advanced thermal management solution intended for general-purpose applications, such as computer motherboards, consumer electronics, and automotive applications. Its primary purpose is to dissipate large amounts of heat generated by high-powered electrical components. The ATS-05F-106-C2-R1 features a PCBA mounting design that permits high power density, low height, and optimal protection.This heat sink boasts a slim profile and is composed of aluminum alloy which has an excellent surface treatment to provide superior dissipation performance. It is also equipped with a die-cast frame that allows excellent installation and mechanical strength. It has a corrosion-resistant design and comes equipped with numerous features, such as spring-loaded terminals for easy connections and mounting posts for secure installation.This advanced thermal management component provides many advantages for its users such as improved heat conduction, minimized power dissipation, and enhanced system stability. It allows higher current loads and extended operational lifetime of the device. Additionally, it facilitates a longer product life for electronic components operating in high-temperature environments.

Working Principle

The working principle of the ATS-05F-106-C2-R1 is based on thermal transfer. The heat generated by the electrical components is transferred to the aluminum alloy body of the heat sink through a thermal interface material. The aluminum alloy body acts as a heat sink and dissipates the heat away from the components.The die-cast frame and mounting posts of the device improve its installation process and mechanical strength. Moreover, its spring-loaded terminals enable easy connection to other components. The device is designed to ensure optimal protection from environmental damage, minimize power dissipation, and preserve the system\'s stability.The aluminum alloy body of the heat sink is designed with an anodized surface treatment in order to facilitate improved heat conduction, increased cooling performance, and extended operational lifetime of the device. The anodized layer also helps to protect against corrosion, making it ideal for use in high-temperature environments.

Conclusion

In summary, the ATS-05F-106-C2-R1 is a thermal management product designed for general-purpose applications and provides optimal protection from environmental damage. It has a PCBA mounting design that permits high power density, low height, and optimal protection. Its anodized aluminum alloy body facilitates improved heat conduction and extended operational lifetime of the device. This thermal - heat sink is also equipped with numerous features, such as spring-loaded terminals for easy connections and mounting posts for secure installation, in order to ensure its optimal performance.

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