| Allicdata Part #: | ATS-05F-107-C3-R1-ND |
| Manufacturer Part#: |
ATS-05F-107-C3-R1 |
| Price: | $ 4.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X40X9.5MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05F-107-C3-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.44150 |
| 30 +: | $ 4.19496 |
| 50 +: | $ 3.94808 |
| 100 +: | $ 3.70138 |
| 250 +: | $ 3.45462 |
| 500 +: | $ 3.20786 |
| 1000 +: | $ 3.14617 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices used in a variety of applications to reduce the thermal energy generated by components or systems that operate at high temperatures. The ATS-05F-107-C3-R1 is a high-performance heat sink designed to meet the needs of today’s high-reliability, high-density thermal management applications. This heat sink is intended for applications where the environment, device size, and operating temperature range require a superior thermal performance.
The highly efficient design of this heat sink makes it an ideal choice for products that require higher power density and lower thermal resistances. It is also suitable for use in a wide range of applications, from consumer electronics and computers to industrial and medical equipment. Additionally, the ATS-05F-107-C3-R1 can help reduce equipment overheating and increase system reliability.
The ATS-05F-107-C3-R1 is a thermally efficient, cost-effective and low profile heat sink that maximizes its surface area and minimizes resistance. It is composed of aluminum fin stock, extruded or stamped fins, and a copper or aluminum block. The fin stock and the base are thermally bonded together using a special thermal bonding technique. This heat sink is designed to provide superior thermal performance with an ultra-low profile, allowing it to fit into the tightest spaces. Its low profile and light weight also make it easy to install in difficult-to-reach spaces.
The operating principle of a heat sink is simple. Heat from the device or system being cooled is absorbed by the heat sink, which then dissipates the heat into the surrounding environment. The ATS-05F-107-C3-R1 is designed to maximize heat absorption and dissipation. It features a highly efficient thermal design, utilizing a combination of thick fin stock and an enhanced fin arrangement to provide superior heat transfer performance. The thin copper or aluminum fin stock ensures that the temperature differences between the two sides of the heat sink are minimized, resulting in excellent heat transfer. The thick fin stock also ensures that the heat sink is able to dissipate larger amounts of heat.
The ATS-05F-107-C3-R1 is an ideal solution for thermal management in a variety of high-density, high-reliability applications. Its superior heat transfer capabilities, combined with its low profile and light weight, make it a great choice for applications that require a compact and efficient solution. This heat sink is also easy to install and provides excellent thermal performance in high temperature environments. Furthermore, its low profile and light weight make it an ideal choice for applications where space and weight are important factors.
The specific data is subject to PDF, and the above content is for reference