| Allicdata Part #: | ATS-05F-140-C3-R0-ND |
| Manufacturer Part#: |
ATS-05F-140-C3-R0 |
| Price: | $ 3.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05F-140-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.07881 |
| 30 +: | $ 2.99586 |
| 50 +: | $ 2.82933 |
| 100 +: | $ 2.66295 |
| 250 +: | $ 2.49652 |
| 500 +: | $ 2.41329 |
| 1000 +: | $ 2.16364 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.55°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are essential components in providing thermal solutions for a wide variety of electronic devices. With the advances in technology, these components need to be able to withstand higher temperatures and handle larger amounts of power. ATS-05F-140-C3-R0 is a type of heat sink that provides reliable thermal solutions for a variety of applications. This article will discuss the application field and working principle of ATS-05F-140-C3-R0 heat sinks.
Application Field
The ATS-05F-140-C3-R0 heat sink is specifically designed for cooling and protecting high-powered electronic devices. It is suitable for applications with high thermal loads, including power amplifiers, telecommunications systems, radio transceivers and more. The heat sink can also be used to protect sensitive components from overheating. Its design ensures that it dissipates heat quickly, thus preventing thermal runaway.
The ATS-05F-140-C3-R0 has a square shaped aluminum base and a mechanically pressed aluminum heat sink with integrated fins. The heat sink is designed with an optimized fin pattern for maximum cooling efficiency. It is optimized to ensure that all components are evenly cooled, which increases the reliability of the electronics being protected. The heat sink is available in a variety of sizes, ranging from 80mm x 80mm to 600mm x 600mm.
Working Principle
The working principle of the ATS-05F-140-C3-R0 heat sink is simple. Heat generated by the electronic device is absorbed by the base of the heat sink, which is typically made from thermally conductive material like aluminum. The heat is then transferred from the base to the fins of the heat sink. As the fins are exposed to the surrounding environment, they rapidly dissipate the heat. The heat is dissipated into the air to keep the temperature of the electronic device within its desired range.
In addition to dissipating heat into the environment, the ATS-05F-140-C3-R0 heat sink is also designed to be energy efficient. It features a high thermal conductivity that is optimized to reduce the resistance between the heat source and the heat sink. This reduces the amount of energy required to keep the electronic device from overheating. The heat sink is also designed in such a way that it reduces the amount of noise generated as it dissipates heat.
Conclusion
The ATS-05F-140-C3-R0 heat sink is an excellent choice for providing reliable thermal solutions for high-powered electronic devices. It is suitable for applications with high thermal loads and provides optimal temperatures for the electronic device that is being cooled. The heat sink is designed with a high thermal conductivity for better energy efficiency and noise reduction. All in all, the ATS-05F-140-C3-R0 provides the perfect thermal solution for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference