| Allicdata Part #: | ATS-05F-153-C3-R0-ND |
| Manufacturer Part#: |
ATS-05F-153-C3-R0 |
| Price: | $ 3.91 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05F-153-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.55131 |
| 30 +: | $ 3.35370 |
| 50 +: | $ 3.15643 |
| 100 +: | $ 2.95917 |
| 250 +: | $ 2.76189 |
| 500 +: | $ 2.56462 |
| 1000 +: | $ 2.51530 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are a type of passive thermal device used to transfer heat away from an object, usually an electronic component. This type of device is necessary to ensure that components operate within their desired temperature ranges and to prevent overheating which can cause system failure.
The ATS-05F-153-C3-R0 is a heat sink specifically designed for cooling electronic devices in a wide variety of application fields. This heat sink is constructed from aluminum alloy and features a large fin area for greater cooling efficiency. It also incorporates a simplified design for easy installation and maintenance. The ATS-05F-153-C3-R0 is compatible with a wide variety of cooling fans and can be used with any system.
The ATS-05F-153-C3-R0 is most commonly used in application fields that require cooling of devices, such as telecommunications, medical equipment, computers, audio/visual equipment, automotive systems, and power systems. This heat sink can dissipate large amounts of heat generated by high-power components, ensuring the proper and safe operation of these components. By providing efficient and reliable thermal management, the ATS-05F-153-C3-R0 helps to protect these sensitive components from overheating.
The ATS-05F-153-C3-R0 employs a “pin-fin” heat sink design, which consists of a large number of flat metal fins connected to a central heat sink base. This design provides a greater surface area than conventional heat sinks, which increases cooling efficiency. The pin-fin design also reduces the area exposed to air, resulting in lower wind resistance and better air flow through the heat sink. This improved air flow also helps to reduce the noise generated by the fans. Additionally, the ATS-05F-153-C3-R0 has a simple and compact design, allowing it to integrate easily into most system designs.
The ATS-05F-153-C3-R0 is a reliable and efficient thermal management solution for cooling electronic devices in a wide range of applications. Its unique pin-fin design helps to maximize air flow and increase cooling efficiency, while its compact and simple design allows for easy integration into existing systems. With its robust construction and high-performance thermal management, the ATS-05F-153-C3-R0 is an ideal choice for ensuring proper cooling and protection of electronic components.
The specific data is subject to PDF, and the above content is for reference