ATS-05F-155-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	5.47°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-05F-155-C3-R0 is a thermal heat sink specifically designed for the cooling of high power electronic devices. It is highly efficient in dissipating heat away from the electronic components and providing cooling to the system. The ATS-05F-155-C3-R0 is made from a high grade aluminum substrate allowing for better thermal conductivity. This heat sink is perfect for providing reliable cooling to a wide range of high-end electronic devices.

Application Field and Working Principle

The ATS-05F-155-C3-R0 is designed for the cooling of high-end electronic components. It is suitable for LED applications, processors, GPUs, CPUs, and other demanding electronic components. It has been tested for up to 100 watts of power dissipation under full load. The ATS-05F-155-C3-R0 is a passive heat sink, meaning it requires no power source to operate. Instead, it uses convection to dissipate the heat away from the electronic components. The ATS-05F-155-C3-R0 is composed of two parts, the fins and the base. The aluminum fins are designed to create a large surface area, allowing for maximum convection. The larger the surface area, the more heat that can be dissipated. The fins are connected to the base, which is composed of a zinc alloy material. The purpose of the base is to provide a firm connection between the heat sink and the electronic components. It also acts as a heat sink to take heat away from the components.The ATS-05F-155-C3-R0 heat sink comes with a mounting clip that allows for easy installation. The mounting clip provides a secure and tight fit to the electronic components. The mounting clip also provides flexibility to the heat sink, as it allows the user to adjust the position of the heat sink so that it’s positioned in the most optimal position for cooling.The key feature of the ATS-05F-155-C3-R0 is its unique fin design. The fins are designed to optimize the cooling performance of the heat sink. The design of the fins allows for more efficient heat convection and larger surface area for maximum heat dissipation. The fin design also reduces turbulence, which reduces the noise generated by the fan when it’s running. The fin design is also very efficient in capturing heat and dissipating it away.Overall, the ATS-05F-155-C3-R0 heat sink is perfect for providing reliable cooling to high-end electronic components. It is designed for easy installation and is capable of dissipating up to 100 watts of power under full load. The fin design is very effective in capturing and dissipating heat, and the base provides a secure connection between the components and the heat sink. The ATS-05F-155-C3-R0 is an ideal solution for cooling demanding electronic components.

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