ATS-05F-171-C1-R0

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Heat sinks are used to transfer heat away from components or systems, allowing them to maintain a safe operating temperature. The ATS-05F-171-C1-R0 is a type of heat sink developed by ATS Thermal Solutions. This thermal solution is designed to manage heat dissipation within electronic devices, providing a better environment for long term performance and increased lifetime.

Application Field

The ATS-05F-171-C1-R0 is designed for use in a variety of electronic applications. It is used in telecommunication systems, portable digital devices, and computers. It is suitable for a wide range of PCB applications, ranging from LED lighting to automotive electronics. It is also designed for use in GPS systems, RF modules, and FPGAS. This heat sink solution is perfect for small form-factor applications where space is at a premium.

Working Principle

The ATS-05F-171-C1-R0 uses a unique passive thermal-management design. This design incorporates an aluminum heat sink, a copper plate, and a thermal conductive adhesive. These components work together to increase the rate of heat transfer away from the component or system. The aluminum heat sink acts as the primary heat absorbent, drawing heat away from the component or system and dissipating it into the surrounding air. The copper plate helps to even out the heat distribution across the entire surface area. The thermal adhesive provides a thermal bridge between the component or system and the aluminum heat sink, enabling the heat to be efficiently transferred away.

The ATS-05F-171-C1-R0 also features enhanced copper fins, which are designed to further improve the thermal transfer process. The enhanced copper fins reduce the rate of heat spreading, enabling more efficient heat dissipation. This helps to increase the overall thermal performance of the system. The enhanced copper fins also increase the overall surface area, allowing more efficient heat transfer from the component or system.

The ATS-05F-171-C1-R0 is also designed with variable fin heights. This feature helps to maximize the dissipation of heat away from the component or system. The height of the fin can be adjusted based on the level of heat generated by the component or system. By adjusting the fin height, more efficient heat dissipation can be achieved. This allows for a more effective thermal-management solution.

Overall, the ATS-05F-171-C1-R0 is an efficient thermal-management solution. It combines an aluminum heat sink, copper plate, and thermal adhesive to provide an effective solution for managing heat dissipation in electronic devices. It is designed for use in a variety of applications, ranging from LED lighting to automotive electronics. It also features enhanced copper fins and adjustable fin heights, allowing it to be tailored to the specific thermal needs of the system. The ATS-05F-171-C1-R0 is an excellent choice for controlling heat dissipation in electronics, providing long-term performance and increased lifetime.

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