| Allicdata Part #: | ATS-05F-185-C3-R0-ND |
| Manufacturer Part#: |
ATS-05F-185-C3-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-05F-185-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.88647 |
| 30 +: | $ 3.67059 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-Heat Sinks are the most common form of cooling system used in modern day computing systems, as they can effectively dissipate the heat generated during normal operation. The ATS-05F-185-C3-R0 is one such device that has been developed specifically for application in cooling electronics. This Heat Sink provides efficient heat transfer and is designed for easy assembly. It is also suitable for extreme thermal cooling such as during die casting, injection molding, or extrusion processes.
The ATS-05F-185-C3-R0 consists of a copper rod which runs through the center of a rectangular aluminum alloy heat sink plate that is surrounded by a thick aluminum fin profile. The fin profile helps to maximize the surface area so that heat can be dissipated more efficiently. The heat is drawn away by the fins, as air from the computer\'s fan passes through them. The heat then dissipates into the surrounding atmosphere.
The ATS-05F-185-C3-R0 has several advantages for applications in cooling electronics systems. It is made from a durable material, so that it can withstand frequent thermal exposure and movement. The fins are designed specifically to increase air flow and cooling efficiency. The device also has an integrated base which helps to attach it to the circuit board. Additionally, the fin profile is designed to minimize interference with other components on the board, which helps to keep the system running smoothly and efficiently.
The heat sink operates in a simple yet effective manner. As components within the circuit board generate heat, it is dissipated through the fins and drawn away by the heat sink. The air flowing through the fins helps to draw away the heat and disperse it into the atmosphere. This helps to keep the components operating at a safe temperature and allows the system to maintain efficient performance.
The ATS-05F-185-C3-R0 Heat Sink is a highly efficient device that is ideally suited to cooling applications such as electronics and die-cast molds. It is capable of providing effective cooling with minimal interference and is designed for easy installation and maintenance. This makes it an ideal choice for any application where fast, reliable cooling is essential.
The specific data is subject to PDF, and the above content is for reference