ATS-05F-20-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-05F-20-C3-R0-ND

Manufacturer Part#:

ATS-05F-20-C3-R0

Price: $ 4.67
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-05F-20-C3-R0 datasheetATS-05F-20-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.19895
30 +: $ 3.96543
50 +: $ 3.73225
100 +: $ 3.49896
250 +: $ 3.26570
500 +: $ 3.03243
1000 +: $ 2.97412
Stock 1000Can Ship Immediately
$ 4.67
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.21°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS - 05F - 20 - C3 - R0 is a type of thermal - heat sink used for a variety of applications. Heat sinks are used to dissipate excessive heat that is generated by electrical components. The ATS - 05F - 20 - C3 - R0 is a high-performance heat sink that is designed to provide superior cooling performance while still maintaining a small form factor. The key components of the ATS - 05F - 20 - C3 - R0 are the heat sink itself, heat conductive material, and a fan.

The design of the ATS - 05F - 20 - C3 - R0 starts with the heat sink. It is constructed from a lightweight aluminum alloy that is highly conductive and provides excellent heat dissipation. The heat sink is designed to direct heat away from the bottom of the component, allowing the component to remain at a lower temperature while in operation. The heat sink also provides excellent air flow, allowing for a rapid cooling response.

The heat conductive material is the next important component for the ATS - 05F - 20 - C3 - R0. It is used to bridge the gap between the component and the heat sink, transferring the heat from the component to the heat sink. The material is highly thermally conductive and has a high thermal conductivity rating. This ensures that the heat is efficiently and quickly transferred to the heat sink, allowing the component to remain at a lower temperature during operation.

Finally, the ATS - 05F - 20 - C3 - R0 features a fan to provide additional cooling. The fan is designed to provide a steady flow of air over the heat sink, dissipating the heat quickly and efficiently. The fan is also designed to be quiet and energy efficient, ensuring that the device does not generate excessive noise or excessive energy usage.

Overall, the ATS - 05F - 20 - C3 - R0 is an excellent choice for applications that require both superior cooling performance and a small form factor. It is designed to provide a high level of efficiency and reliability while consuming minimal energy and space. The combination of the lightweight aluminum heat sink, the thermally conductive material, and the fan provides a high-performance heat sink that can keep electrical components operating reliably and at optimal temperatures.

The specific data is subject to PDF, and the above content is for reference

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