ATS-05F-210-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-05F-210-C1-R0-ND

Manufacturer Part#:

ATS-05F-210-C1-R0

Price: $ 5.32
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X12MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-05F-210-C1-R0 datasheetATS-05F-210-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.78863
30 +: $ 4.52256
50 +: $ 4.25653
100 +: $ 3.99055
250 +: $ 3.72451
500 +: $ 3.45848
1000 +: $ 3.39196
Stock 1000Can Ship Immediately
$ 5.32
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.472" (12.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.17°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal – Heat Sinks are critical components that are used to dissipate the heat that regular computer components generate to ensure that they can continue to perform excellently in their designated space. The ATS-05F-210-C1-R0 is one such component that is designed to dissipate the heat generated by equipment such as CPUs and graphics cards that are utilized in industrial applications.The ATS-05F-210-C1-R0 stands out from other Thermal – Heat Sinks because of its highly advanced design, which includes fins, stacked passes, and small tubes. All of these components work in concert to efficiently dissipate heat away from components, allowing them to stay cool during operation. Additionally, this thermal management solution is efficient and cost-effective as well, since its components are designed to be long lasting and resilient to corrosion.The overall design of the ATS-05F-210-C1-R0 is modular and hence, it is easy to install into computers or other systems. Furthermore, this solution has an active heat dissipation system, which gives the computer greater protection from overheating. In addition, it is ideal for use in small form factor PCs, gaming systems, and other highly demanding computing situations.At the heart of the ATS-05F-210-C1-R0 is its working principle. It works by taking the heat generated by the components and transferring them through a network of fins, stacked passes, and small tubes to the exterior of the case. This process of heat dissipation takes place thanks to a combination of natural and forced convection, which make the heat more manageable and easier to dissipate.Also, the ATS-05F-210-C1-R0 has a state-of-the-art air diffusion system, which further enhances the cooling process by helping to regulate the air temperature and ensure that the components are kept at an optimal operating temperature. In conclusion, the ATS-05F-210-C1-R0 is an excellent solution for thermal management and heat dissipation for industrial applications. Its innovative design, efficient working principle, and state-of-the-art air diffusion system make it an ideal choice for users who need an effective and reliable thermal management component.

The specific data is subject to PDF, and the above content is for reference

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