ATS-05F-23-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-05F-23-C3-R0-ND

Manufacturer Part#:

ATS-05F-23-C3-R0

Price: $ 5.12
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X15MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-05F-23-C3-R0 datasheetATS-05F-23-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.60341
30 +: $ 4.34784
50 +: $ 4.09210
100 +: $ 3.83632
250 +: $ 3.58057
500 +: $ 3.32481
1000 +: $ 3.26087
Stock 1000Can Ship Immediately
$ 5.12
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 12.06°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

The aim of thermal management is to dissipate the generated heat from components to maintain acceptable temperatures. Heat sinks are the major source when it comes to thermal solutions designed to cope with these dissipating requirements. One of the more popular types of heat sinks is the ATS-05F-23-C3-R0. It is a highly efficient extruded aluminum heat sink and it can be used in a number of applications.

Applications

The ATS-05F-23-C3-R0 is designed to be used for cooling Power Electronic devices, IGBTs, and DC/DC converters. The use of this specific type of heat sink can significantly reduce a system’s thermal resistance, allowing components to stay within their optimal temperatures which increases heat dissipation and overall system reliability. Its unique design also allows it to achieve heat dissipation levels that are higher than other types of heat sinks.The ATS-05F-23-C3-R0 has also been used in applications that require a fast thermal response, such as LED lighting modules and automotive applications.

Working Principle

The ATS-05F-23-C3-R0 utilizes the thermal conductivity of aluminum and a finned heat sink design to provide a solution that can effectively dissipate heat. The finned design helps to create an increased surface area for heat conduction, allowing the heat to be spread out over a larger area and absorbed more rapidly by the environment. The fins of the heat sink act as a heatsink for additional thermal dissipation. In addition, the aluminum material helps to dissipate heat quickly due to its superior thermal conductivity.

The ATS-05F-23-C3-R0’s efficient design allows for the maximum amount of heat to be dissipated while minimizing the amount of energy used to generate the heat. This means that the heat sink can cool components quickly and efficiently while consuming less power, allowing for a more efficient system.

The ATS-05F-23-C3-R0 also features a special mounting bracket which helps to distribute the heat more evenly over the heat sink’s surface. The bracket also acts as a “backplane”, which provides additional support to the heat sink and also increases the heat dissipation efficiency. In addition, the bracket helps to reduce system noise, allowing components to be cooled without generating excess noise.

Conclusion

The ATS-05F-23-C3-R0 is a highly efficient aluminum based extruded heat sink designed to provide a reliable and effective thermal solution. It is a popular choice for cooling Power Electronic devices, IGBTs, and DC/DC converters. The finned design of the heat sink helps to create an increased surface area that allows heat to be absorbed more rapidly, and its mounting bracket distributes heat over the heat sink’s surface more evenly and helps to reduce system noise. The ATS-05F-23-C3-R0 is an ideal heat sink option for applications that require fast thermal response and efficient thermal management.

The specific data is subject to PDF, and the above content is for reference

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